Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-91-210-41-007000

116-91-210-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,830 -
116-91-210-41-007000

Datenblatt

Tube 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-308-41-007000

116-47-308-41-007000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

2,195 -
116-47-308-41-007000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-306-41-105000

110-41-306-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,484 -
110-41-306-41-105000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-91-306-41-105000

110-91-306-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,836 -
110-91-306-41-105000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
517-87-304-14-051111

517-87-304-14-051111

CONN SOCKET PGA 304POS GOLD

Preci-Dip

3,728 -
517-87-304-14-051111

Datenblatt

Bulk 517 Active PGA 304 (14 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
36-6513-10H

36-6513-10H

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

3,134 -
36-6513-10H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-3508-202

18-3508-202

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,485 -
18-3508-202

Datenblatt

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-3508-302

18-3508-302

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,023 -
18-3508-302

Datenblatt

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-820-90WR

14-820-90WR

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3,658 -
14-820-90WR

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
14-822-90WR

14-822-90WR

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3,222 -
14-822-90WR

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
714-43-149-31-018000

714-43-149-31-018000

CONN SOCKET SIP 49POS GOLD

Mill-Max Manufacturing Corp.

3,138 -
714-43-149-31-018000

Datenblatt

Bulk 714 Active SIP 49 (1 x 49) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-47-316-41-003000

115-47-316-41-003000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

2,022 -
115-47-316-41-003000

Datenblatt

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-210-31-018000

614-93-210-31-018000

SOCKET CARRIER LOWPRO .200 10POS

Mill-Max Manufacturing Corp.

2,696 -
614-93-210-31-018000

Datenblatt

Tube 614 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-210-31-018000

614-43-210-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,414 -
614-43-210-31-018000

Datenblatt

Tube 614 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-91-318-41-001000

110-91-318-41-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

2,980 -
110-91-318-41-001000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-47-314-41-117000

114-47-314-41-117000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

2,661 -
114-47-314-41-117000

Datenblatt

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-13-306-41-780000

104-13-306-41-780000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

2,364 -
104-13-306-41-780000

Datenblatt

Tube 104 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
317-91-105-41-005000

317-91-105-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

3,835 -
317-91-105-41-005000

Datenblatt

Bulk 317 Active SIP 5 (1 x 5) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-424-41-001000

110-47-424-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

2,085 -
110-47-424-41-001000

Datenblatt

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
28-6556-10

28-6556-10

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,920 -
28-6556-10

Datenblatt

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
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