Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
12-6810-90WR

12-6810-90WR

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

2,343 -
12-6810-90WR

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
123-13-310-41-001000

123-13-310-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

2,957 -
123-13-310-41-001000

Datenblatt

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-41-320-41-001000

210-41-320-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,755 -
210-41-320-41-001000

Datenblatt

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-91-320-41-001000

210-91-320-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,903 -
210-91-320-41-001000

Datenblatt

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-306-31-012000

614-41-306-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,253 -
614-41-306-31-012000

Datenblatt

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-306-31-012000

614-91-306-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,554 -
614-91-306-31-012000

Datenblatt

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
517-87-305-18-101111

517-87-305-18-101111

CONN SOCKET PGA 305POS GOLD

Preci-Dip

3,014 -
517-87-305-18-101111

Datenblatt

Bulk 517 Active PGA 305 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-148-15-063135

546-87-148-15-063135

CONN SOCKET PGA 148POS GOLD

Preci-Dip

2,404 -
546-87-148-15-063135

Datenblatt

Bulk 546 Active PGA 148 (15 x 15) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-148-15-063136

546-87-148-15-063136

CONN SOCKET PGA 148POS GOLD

Preci-Dip

2,980 -
546-87-148-15-063136

Datenblatt

Bulk 546 Active PGA 148 (15 x 15) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-93-210-31-007000

614-93-210-31-007000

SOCKET CARRIER LOWPRO .200 10POS

Mill-Max Manufacturing Corp.

3,687 -
614-93-210-31-007000

Datenblatt

Tube 614 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-210-31-007000

614-43-210-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,495 -
614-43-210-31-007000

Datenblatt

Tube 614 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-310-41-008000

116-41-310-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,415 -
116-41-310-41-008000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-310-41-008000

116-91-310-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,591 -
116-91-310-41-008000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-47-310-41-001000

123-47-310-41-001000

STANDARD WIRE WRAP DBL SKT

Mill-Max Manufacturing Corp.

2,709 -
123-47-310-41-001000

Datenblatt

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-308-41-006000

116-93-308-41-006000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

2,771 -
116-93-308-41-006000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-308-41-006000

116-43-308-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,727 -
116-43-308-41-006000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-93-210-11-480000

605-93-210-11-480000

SOCKET CARRIER LOWPRO .200 10POS

Mill-Max Manufacturing Corp.

2,322 -
605-93-210-11-480000

Datenblatt

Tube 605 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-43-210-11-480000

605-43-210-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

2,431 -
605-43-210-11-480000

Datenblatt

Tube 605 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-47-111-41-005000

317-47-111-41-005000

STANDRD SOLDRTL SNG SKT

Mill-Max Manufacturing Corp.

3,190 -
317-47-111-41-005000

Datenblatt

Bulk 317 Active SIP 11 (1 x 11) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-306-31-018000

614-41-306-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,655 -
614-41-306-31-018000

Datenblatt

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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