Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-47-314-41-605000

110-47-314-41-605000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

2,648 -
110-47-314-41-605000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-93-308-41-012000

146-93-308-41-012000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

3,806 -
146-93-308-41-012000

Datenblatt

Tube 146 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-43-308-41-012000

146-43-308-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.

3,086 -
146-43-308-41-012000

Datenblatt

Tube 146 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-41-316-41-001000

210-41-316-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,009 -
210-41-316-41-001000

Datenblatt

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-91-316-41-001000

210-91-316-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,791 -
210-91-316-41-001000

Datenblatt

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
24-6511-11

24-6511-11

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,925 -
24-6511-11

Datenblatt

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
110-93-210-41-105000

110-93-210-41-105000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

3,252 -
110-93-210-41-105000

Datenblatt

Tube 110 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-210-41-105000

110-43-210-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,485 -
110-43-210-41-105000

Datenblatt

Tube 110 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-310-41-105000

110-43-310-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,669 -
110-43-310-41-105000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-13-306-41-770000

104-13-306-41-770000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

3,891 -
104-13-306-41-770000

Datenblatt

Tube 104 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
605-41-210-11-480000

605-41-210-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

3,449 -
605-41-210-11-480000

Datenblatt

Tube 605 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-91-210-11-480000

605-91-210-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

3,571 -
605-91-210-11-480000

Datenblatt

Tube 605 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
30-9513-10H

30-9513-10H

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

3,506 -
30-9513-10H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-6810-90TWR

12-6810-90TWR

CONN IC DIP SOCKET 12POS TIN

Aries Electronics

2,820 -
12-6810-90TWR

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
317-47-110-41-005000

317-47-110-41-005000

STANDRD SOLDRTL SNG SKT

Mill-Max Manufacturing Corp.

3,583 -
317-47-110-41-005000

Datenblatt

Bulk 317 Active SIP 10 (1 x 10) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-210-41-006000

116-93-210-41-006000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

3,453 -
116-93-210-41-006000

Datenblatt

Tube 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-41-314-41-001000

115-41-314-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,518 -
115-41-314-41-001000

Datenblatt

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-91-314-41-001000

115-91-314-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.

2,231 -
115-91-314-41-001000

Datenblatt

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-91-104-41-005000

317-91-104-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

3,599 -
317-91-104-41-005000

Datenblatt

Bulk 317 Active SIP 4 (1 x 4) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
917-41-104-41-001000

917-41-104-41-001000

CONN SKT TRANSISTOR

Mill-Max Manufacturing Corp.

3,302 -
917-41-104-41-001000

Datenblatt

Tube 917 Active Transistor, TO-5 4 (Round) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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