Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
614-91-306-31-018000

614-91-306-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,705 -
614-91-306-31-018000

Datenblatt

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-87-121-13-061112

614-87-121-13-061112

CONN SOCKET PGA 121POS GOLD

Preci-Dip

2,562 -
614-87-121-13-061112

Datenblatt

Bulk 614 Active PGA 121 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-47-320-41-001000

115-47-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

3,695 -
115-47-320-41-001000

Datenblatt

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-47-420-41-001000

115-47-420-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

2,787 -
115-47-420-41-001000

Datenblatt

Tube 115 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-41-306-11-480000

605-41-306-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

2,851 -
605-41-306-11-480000

Datenblatt

Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-91-306-11-480000

605-91-306-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

3,894 -
605-91-306-11-480000

Datenblatt

Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-310-41-780000

104-11-310-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,916 -
104-11-310-41-780000

Datenblatt

Tube 104 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
42-6513-11H

42-6513-11H

CONN IC DIP SOCKET 42POS GOLD

Aries Electronics

2,899 -
42-6513-11H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-820-90

20-820-90

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,746 -
20-820-90

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
20-820-90TWR

20-820-90TWR

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

2,031 -
20-820-90TWR

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
20-822-90

20-822-90

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,921 -
20-822-90

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
24-6823-90T

24-6823-90T

CONN IC DIP SOCKET 24POS TIN

Aries Electronics

2,510 -
24-6823-90T

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
20-810-90T

20-810-90T

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

3,786 -
20-810-90T

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
22-4820-90C

22-4820-90C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3,402 -
22-4820-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-6820-90C

22-6820-90C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3,650 -
22-6820-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-6822-90C

22-6822-90C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

2,045 -
22-6822-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-83-238-19-101101

510-83-238-19-101101

CONN SOCKET PGA 238POS GOLD

Preci-Dip

3,276 -
510-83-238-19-101101

Datenblatt

Bulk 510 Active PGA 238 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
22-6823-90C

22-6823-90C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

2,245 -
22-6823-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-83-289-17-000101

510-83-289-17-000101

CONN SOCKET PGA 289POS GOLD

Preci-Dip

3,397 -
510-83-289-17-000101

Datenblatt

Bulk 510 Active PGA 289 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-41-314-41-605000

110-41-314-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,251 -
110-41-314-41-605000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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