Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
614-83-100-10-000112

614-83-100-10-000112

CONN SOCKET PGA 100POS GOLD

Preci-Dip

3,340 -
614-83-100-10-000112

Datenblatt

Bulk 614 Active PGA 100 (10 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
317-47-109-41-005000

317-47-109-41-005000

STANDRD SOLDRTL SNG SKT

Mill-Max Manufacturing Corp.

3,504 -
317-47-109-41-005000

Datenblatt

Bulk 317 Active SIP 9 (1 x 9) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-306-41-008000

116-41-306-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,501 -
116-41-306-41-008000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-306-41-008000

116-91-306-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,993 -
116-91-306-41-008000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
122-13-210-41-001000

122-13-210-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

2,460 -
122-13-210-41-001000

Datenblatt

Tube 122 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-44-316-41-003000

115-44-316-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,323 -
115-44-316-41-003000

Datenblatt

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-91-314-41-003000

115-91-314-41-003000

SOCKET IC OPEN LOWPRO .300 14POS

Mill-Max Manufacturing Corp.

3,233 -
Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Thermoplastic
115-41-314-41-003000

115-41-314-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,196 -
115-41-314-41-003000

Datenblatt

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-47-322-41-001000

210-47-322-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

3,280 -
210-47-322-41-001000

Datenblatt

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-47-422-41-001000

210-47-422-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

3,814 -
210-47-422-41-001000

Datenblatt

Tube 210 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-310-41-003000

116-93-310-41-003000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

3,230 -
116-93-310-41-003000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-310-41-003000

116-43-310-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,710 -
116-43-310-41-003000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-13-210-41-001000

110-13-210-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

3,856 -
110-13-210-41-001000

Datenblatt

Tube 110 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-210-31-002000

614-41-210-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,154 -
614-41-210-31-002000

Datenblatt

Tube 614 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-210-31-002000

614-91-210-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,199 -
614-91-210-31-002000

Datenblatt

Tube 614 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
17-0501-20

17-0501-20

CONN SOCKET SIP 17POS TIN

Aries Electronics

3,534 -
17-0501-20

Datenblatt

Bulk 501 Active SIP 17 (1 x 17) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
17-0501-30

17-0501-30

CONN SOCKET SIP 17POS TIN

Aries Electronics

3,074 -
17-0501-30

Datenblatt

Bulk 501 Active SIP 17 (1 x 17) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
64-9518-11

64-9518-11

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics

2,766 -
64-9518-11

Datenblatt

Bulk 518 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-6820-90C

18-6820-90C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,610 -
18-6820-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-6822-90C

18-6822-90C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,753 -
18-6822-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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