Thermische Kühlkörper

制造商 Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
625-45ABT1E

625-45ABT1E

HEATSINK FOR 25MM BGA

Wakefield-Vette

2,063 -
625-45ABT1E

Datenblatt

Bulk 625 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 0.984 (25.00mm) 0.984 (25.00mm) - 0.450 (11.43mm) - 8.00°C/W @ 400 LFM - Aluminum
642-45ABT3

642-45ABT3

HEATSINK FOR 35MM BGA

Wakefield-Vette

3,876 -
642-45ABT3

Datenblatt

Bulk 642 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.450 (11.43mm) - 6.00°C/W @ 500 LFM - Aluminum
659-65ABT5

659-65ABT5

HEATSINK EXTRUSION 37MM

Wakefield-Vette

3,193 -
659-65ABT5

Datenblatt

Bulk 659 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.450 (36.83mm) 1.450 (36.83mm) - 0.650 (16.51mm) 2.0W @ 20°C 1.50°C/W @ 600 LFM - Aluminum
642-35ABT1E

642-35ABT1E

HEATSINK FOR 35MM BGA

Wakefield-Vette

2,336 -
642-35ABT1E

Datenblatt

Bulk 642 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.350 (8.89mm) - 8.00°C/W @ 400 LFM - Aluminum
HSE-B18254-060H-W

HSE-B18254-060H-W

HEAT SINK, EXTRUSION, TO-218, 25

CUI Devices

2,100 -
HSE-B18254-060H-W

Datenblatt

Box HSE Active Board Level, Vertical Bolt On and PC Pin Rectangular, Angled Fins 1.000 (25.40mm) 1.638 (41.60mm) - 0.984 (25.00mm) 8.1W @ 75°C 3.09°C/W @ 200 LFM 9.26°C/W Aluminum Alloy
642-35ABT5

642-35ABT5

HEATSINK FOR 35MM BGA

Wakefield-Vette

3,495 -
642-35ABT5

Datenblatt

Bulk 642 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.350 (8.89mm) - 8.00°C/W @ 400 LFM - Aluminum
642-60ABT1E

642-60ABT1E

HEATSINK FOR 35MM BGA

Wakefield-Vette

3,173 -
642-60ABT1E

Datenblatt

Bulk 642 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.600 (15.24mm) - 6.00°C/W @ 300 LFM - Aluminum
6273BG

6273BG

HEATSINK

Aavid, Thermal Division of Boyd Corporation

3,382 -
6273BG

Datenblatt

Bulk - Active - - - - - - - - - - -
625-25ABT1E

625-25ABT1E

HEATSINK FOR 25MM BGA

Wakefield-Vette

3,389 -
625-25ABT1E

Datenblatt

Bulk 625 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 0.984 (25.00mm) 0.984 (25.00mm) - 0.250 (6.35mm) - 12.00°C/W @ 500 LFM - Aluminum
627-15ABPE

627-15ABPE

HEATSINK FOR TO218/TO220

Wakefield-Vette

2,801 -
627-15ABPE

Datenblatt

Bulk 627 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 0.500 (12.70mm) 1.375 (34.93mm) - 1.500 (38.10mm) 6.0W @ 65°C 5.50°C/W @ 200 LFM - Aluminum
630-35ABT1E

630-35ABT1E

HEATSINK FOR 35MM BGA

Wakefield-Vette

3,835 -
630-35ABT1E

Datenblatt

Bulk 630 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.350 (8.89mm) - 5.00°C/W @ 500 LFM - Aluminum
642-25ABT4E

642-25ABT4E

HEATSINK FOR 35MM BGA

Wakefield-Vette

2,775 -
642-25ABT4E

Datenblatt

Bulk 642 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.250 (6.35mm) - 1.00°C/W @ 400 LFM - Aluminum
HSE-B18635-035H

HSE-B18635-035H

HEAT SINK, EXTRUSION,TO-218, 63.

CUI Devices

2,370 -
HSE-B18635-035H

Datenblatt

Box HSE Active Board Level, Vertical Bolt On and PC Pin Rectangular, Angled Fins 2.500 (63.50mm) 1.638 (41.60mm) - 0.984 (25.00mm) 16.7W @ 75°C 2.24°C/W @ 200 LFM 4.49°C/W Aluminum Alloy
657-20ABPNE

657-20ABPNE

HEATSINK TO-220 W/PINS BLK 2

Wakefield-Vette

3,525 -
657-20ABPNE

Datenblatt

Bulk 657 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.000 (25.40mm) 1.650 (41.91mm) - 2.000 (50.80mm) 6.0W @ 32°C 2.90°C/W @ 200 LFM - Aluminum
286-DBE

286-DBE

HEATSINK TO-220 VERTICAL

Wakefield-Vette

2,514 -
286-DBE

Datenblatt

Bulk 286 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 0.950 (24.13mm) 1.000 (25.40mm) - 0.500 (12.70mm) 3.0W @ 40°C 5.00°C/W @ 600 LFM - Aluminum
HSE-B635-045H

HSE-B635-045H

HEAT SINK, EXTRUSION, TO-220, 63

CUI Devices

3,996 -
HSE-B635-045H

Datenblatt

Box HSE Active Board Level, Vertical Bolt On and PC Pin Rectangular, Angled Fins 2.500 (63.50mm) 1.772 (45.00mm) - 0.500 (12.70mm) 11.7W @ 75°C 3.53°C/W @ 200 LFM 6.41°C/W Aluminum Alloy
624-45AB-T4E

624-45AB-T4E

HEATSINK CPU 21MM SQ

Wakefield-Vette

2,436 -
624-45AB-T4E

Datenblatt

Bulk 624 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 0.827 (21.00mm) 0.827 (21.00mm) - 0.450 (11.43mm) - 15.00°C/W @ 200 LFM - Aluminum
625-60ABT1E

625-60ABT1E

HEATSINK FOR 25MM BGA

Wakefield-Vette

2,192 -
625-60ABT1E

Datenblatt

Bulk 625 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 0.984 (25.00mm) 0.984 (25.00mm) - 0.600 (15.24mm) - 8.00°C/W @ 200 LFM - Aluminum
642-45ABT5

642-45ABT5

HEATSINK FOR 35MM BGA

Wakefield-Vette

3,651 -
642-45ABT5

Datenblatt

Bulk 642 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.450 (11.43mm) - 6.00°C/W @ 500 LFM - Aluminum
642-60ABT4E

642-60ABT4E

HEATSINK FOR 35MM BGA

Wakefield-Vette

3,680 -
642-60ABT4E

Datenblatt

Bulk 642 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.600 (15.24mm) - 6.00°C/W @ 300 LFM - Aluminum
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