Thermische Kühlkörper

制造商 Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
HSE-B20381-040H

HSE-B20381-040H

HEAT SINK, EXTRUSION,TO-220, 38.

CUI Devices

3,715 -
HSE-B20381-040H

Datenblatt

Box HSE Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.500 (38.10mm) 1.260 (32.00mm) - 0.551 (14.00mm) 6.5W @ 75°C 3.62°C/W @ 200 LFM 11.54°C/W Aluminum Alloy
625-35AB

625-35AB

HEATSINK FOR 25MM BGA

Wakefield-Vette

3,498 -
625-35AB

Datenblatt

Bulk 625 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 0.984 (25.00mm) 0.984 (25.00mm) - 0.350 (8.89mm) - 13.10°C/W @ 200 LFM - Aluminum
HSE-B18381-035H

HSE-B18381-035H

HEAT SINK, EXTRUSION, TO-218, 38

CUI Devices

2,347 -
HSE-B18381-035H

Datenblatt

Box HSE Active Board Level, Vertical Bolt On and PC Pin Rectangular, Angled Fins 1.500 (38.10mm) 1.638 (41.60mm) - 0.984 (25.00mm) 12.0W @ 75°C 3.52°C/W @ 200 LFM 6.25°C/W Aluminum Alloy
630-35AB

630-35AB

HEATSINK FOR 35MM BGA

Wakefield-Vette

3,241 -
630-35AB

Datenblatt

Bulk 630 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.350 (8.89mm) - 5.00°C/W @ 500 LFM - Aluminum
CSM221-12AE

CSM221-12AE

HEATSINK BLACK ANODIZED

Ohmite

3,162 -
CSM221-12AE

Datenblatt

Box CSM Active Board Level, Vertical Solderable Feet Rectangular, Fins 0.472 (12.00mm) 0.492 (12.50mm) - 1.228 (31.20mm) 2.0W @ 44°C - 18.00°C/W Aluminum
642-60AB

642-60AB

HEATSINK FOR 35MM BGA

Wakefield-Vette

2,088 -
642-60AB

Datenblatt

Bulk 642 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.600 (15.24mm) - 6.00°C/W @ 300 LFM - Aluminum
529901B00000

529901B00000

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation

2,955 -
529901B00000

Datenblatt

Bulk - Active Board Level Bolt On Rectangular, Fins 2.000 (50.80mm) 1.650 (41.91mm) - 1.000 (25.40mm) 6.0W @ 30°C 1.00°C/W @ 800 LFM 4.50°C/W Aluminum
625-35ABT3

625-35ABT3

HEATSINK FOR 25MM BGA

Wakefield-Vette

2,509 -
625-35ABT3

Datenblatt

Bulk 625 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 0.984 (25.00mm) 0.984 (25.00mm) - 0.350 (8.89mm) - 1.00°C/W @ 400 LFM - Aluminum
529902B02100G

529902B02100G

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation

3,679 -
529902B02100G

Datenblatt

Bulk - Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 2.000 (50.80mm) 1.650 (41.91mm) - 1.000 (25.40mm) 6.0W @ 30°C 1.50°C/W @ 500 LFM 4.50°C/W Aluminum
HSE-B18635-035H-04

HSE-B18635-035H-04

HEAT SINK, EXTRUSION, TO-218, 63

CUI Devices

2,869 -
HSE-B18635-035H-04

Datenblatt

Box HSE Active Board Level, Vertical Clip and PC Pin Rectangular, Angled Fins 2.500 (63.50mm) 1.638 (41.60mm) - 0.984 (25.00mm) 15.1W @ 75°C 2.38°C/W @ 200 LFM 4.97°C/W Aluminum Alloy
642-25ABT3

642-25ABT3

HEATSINK FOR 35MM BGA

Wakefield-Vette

3,310 -
642-25ABT3

Datenblatt

Bulk 642 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.250 (6.35mm) - 1.00°C/W @ 400 LFM - Aluminum
533722B02552G

533722B02552G

HEAT SINK

Aavid, Thermal Division of Boyd Corporation

3,940 -
533722B02552G

Datenblatt

Bulk - Active Board Level, Vertical Clip and PC Pin Rectangular, Fins 1.000 (25.40mm) 1.650 (41.91mm) - 1.000 (25.40mm) 12.0W @ 70°C 4.00°C/W @ 200 LFM 5.70°C/W Aluminum
624-60AB

624-60AB

HEATSINK FOR 21MM BGA

Wakefield-Vette

3,771 -
624-60AB

Datenblatt

Bulk 624 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 0.827 (21.00mm) 0.827 (21.00mm) - 0.600 (15.24mm) - 1.00°C/W @ 400 LFM - Aluminum
659-65AB

659-65AB

HEATSINK EXTRUSION 37MM

Wakefield-Vette

3,036 -
659-65AB

Datenblatt

Bulk 659 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.450 (36.83mm) 1.450 (36.83mm) - 0.650 (16.51mm) 2.0W @ 20°C 1.50°C/W @ 600 LFM - Aluminum
HSE-B20508-035H-W

HSE-B20508-035H-W

HEAT SINK, EXTRUSION, TO-220, 50

CUI Devices

3,865 -
HSE-B20508-035H-W

Datenblatt

Box HSE Active Board Level, Vertical Bolt On and PC Pin Rectangular, Angled Fins 2.000 (50.80mm) 1.378 (35.00mm) - 0.500 (12.70mm) 7.8W @ 75°C 5.17°C/W @ 200 LFM 9.62°C/W Aluminum Alloy
V2136N1-F-LP

V2136N1-F-LP

HEATSINK CPU W/ADHESIVE STAMPED

Assmann WSW Components

2,216 -
V2136N1-F-LP

Datenblatt

Bulk - Active Top Mount Thermal Tape, Adhesive (Included) Square, Fins 1.575 (40.00mm) 1.575 (40.00mm) - 0.394 (10.00mm) - - - Aluminum Alloy
HSE-B20635-035H

HSE-B20635-035H

HEAT SINK, EXTRUSION, TO-220, 63

CUI Devices

3,486 -
HSE-B20635-035H

Datenblatt

Box HSE Active Board Level, Vertical Bolt On and PC Pin Rectangular, Angled Fins 2.500 (63.50mm) 1.375 (34.93mm) - 0.500 (12.70mm) 9.2W @ 75°C 4.35°C/W @ 200 LFM 8.15°C/W Aluminum Alloy
HSE-B20635-035H-01

HSE-B20635-035H-01

HEAT SINK, EXTRUSION, TO-220, 63

CUI Devices

2,784 -
HSE-B20635-035H-01

Datenblatt

Box HSE Active Board Level, Vertical Bolt On and PC Pin Rectangular, Angled Fins 2.500 (63.50mm) 1.378 (35.00mm) - 0.500 (12.70mm) 9.4W @ 75°C 4.49°C/W @ 200 LFM 7.98°C/W Aluminum Alloy
V2201N1-F

V2201N1-F

HEATSINK CPU W/ADHESIVE STAMPED

Assmann WSW Components

3,461 -
V2201N1-F

Datenblatt

Bulk - Active Top Mount Thermal Tape, Adhesive (Included) Square, Fins 1.457 (37.00mm) 1.457 (37.00mm) - 0.551 (14.00mm) - - - Aluminum Alloy
HSE-B18254-035H-00

HSE-B18254-035H-00

HEAT SINK, EXTRUSION, TO-218, 25

CUI Devices

701 -
HSE-B18254-035H-00

Datenblatt

Bulk,Box HSE Active Board Level, Vertical Clip and PC Pin Rectangular, Angled Fins 1.000 (25.40mm) 1.638 (41.60mm) - 0.984 (25.00mm) 10.0W @ 75°C 4.03°C/W @ 200 LFM 7.50°C/W Aluminum Alloy
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