Thermische Kühlkörper

制造商 Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
CSM221-40AE

CSM221-40AE

HEATSINK BLACK ANODIZED

Ohmite

2,077 -
CSM221-40AE

Datenblatt

Box CSM Active Board Level, Vertical Solderable Feet Rectangular, Fins 1.575 (40.00mm) 0.492 (12.50mm) - 1.228 (31.20mm) 6.0W @ 65°C - 12.10°C/W Aluminum
HSE-B20635-035H-W

HSE-B20635-035H-W

HEAT SINK, EXTRUSION, TO-220, 63

CUI Devices

2,773 -
HSE-B20635-035H-W

Datenblatt

Box HSE Active Board Level, Vertical Bolt On and PC Pin Rectangular, Angled Fins 2.500 (63.50mm) 1.378 (35.00mm) - 0.500 (12.70mm) 9.2W @ 75°C 4.35°C/W @ 200 LFM 8.15°C/W Aluminum Alloy
630-60AB

630-60AB

HEATSINK FOR BGA 35MM

Wakefield-Vette

3,632 -
630-60AB

Datenblatt

Bulk 630 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.598 (15.20mm) - 3.00°C/W @ 350 LFM - Aluminum
624-25ABT3

624-25ABT3

HEATSINK FOR 21MM BGA

Wakefield-Vette

3,841 -
624-25ABT3

Datenblatt

Bulk 624 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 0.827 (21.00mm) 0.827 (21.00mm) - 0.250 (6.35mm) - 25.00°C/W @ 200 LFM - Aluminum
642-25ABT1E

642-25ABT1E

HEATSINK FOR 35MM BGA

Wakefield-Vette

2,308 -
642-25ABT1E

Datenblatt

Bulk 642 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.250 (6.35mm) - 1.00°C/W @ 400 LFM - Aluminum
TGH-0380-01

TGH-0380-01

ALUMINIUM HEAT SINK 38X20MM

t-Global Technology

2,018 -
TGH-0380-01

Datenblatt

Bulk - Active Top Mount - Rectangular, Fins 0.787 (20.00mm) 1.496 (38.00mm) - 0.354 (9.00mm) - - - Aluminum
627-25ABPE

627-25ABPE

HEATSINK FOR TO218/TO220

Wakefield-Vette

3,168 -
627-25ABPE

Datenblatt

Bulk 627 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 0.500 (12.70mm) 1.375 (34.93mm) - 2.500 (63.50mm) 6.0W @ 48°C 4.20°C/W @ 200 LFM - Aluminum
642-25ABT5

642-25ABT5

HEATSINK FOR 35MM BGA

Wakefield-Vette

3,783 -
642-25ABT5

Datenblatt

Bulk 642 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.250 (6.35mm) - 1.00°C/W @ 400 LFM - Aluminum
624-25ABT5

624-25ABT5

HEATSINK FOR 21MM BGA

Wakefield-Vette

3,412 -
624-25ABT5

Datenblatt

Bulk 624 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 0.827 (21.00mm) 0.827 (21.00mm) - 0.250 (6.35mm) - 25.00°C/W @ 200 LFM - Aluminum
637-25ABPE

637-25ABPE

HEATSINK TO-220 VERT MT BLK 2.5

Wakefield-Vette

3,709 -
637-25ABPE

Datenblatt

Bulk 637 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 2.500 (63.50mm) 1.375 (34.93mm) - 0.500 (12.70mm) 6.0W @ 48°C 4.20°C/W @ 200 LFM - Aluminum
659-65ABT1E

659-65ABT1E

HEATSINK EXTRUSION 37MM

Wakefield-Vette

2,311 -
659-65ABT1E

Datenblatt

Bulk 659 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.450 (36.83mm) 1.450 (36.83mm) - 0.650 (16.51mm) 2.0W @ 20°C 1.50°C/W @ 600 LFM - Aluminum
659-65ABT4E

659-65ABT4E

HEATSINK EXTRUSION 37MM

Wakefield-Vette

2,429 -
659-65ABT4E

Datenblatt

Bulk 659 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.450 (36.83mm) 1.450 (36.83mm) - 0.650 (16.51mm) 2.0W @ 20°C 1.50°C/W @ 600 LFM - Aluminum
630-25ABT5

630-25ABT5

HEATSINK FOR 35MM BGA

Wakefield-Vette

3,213 -
630-25ABT5

Datenblatt

Bulk 630 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.250 (6.35mm) - 7.00°C/W @ 500 LFM - Aluminum
630-35ABT3

630-35ABT3

HEATSINK FOR 35MM BGA

Wakefield-Vette

2,775 -
630-35ABT3

Datenblatt

Bulk 630 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.350 (8.89mm) - 5.00°C/W @ 500 LFM - Aluminum
630-35ABT4E

630-35ABT4E

HEATSINK FOR 35MM BGA

Wakefield-Vette

2,239 -
630-35ABT4E

Datenblatt

Bulk 630 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.350 (8.89mm) - 5.00°C/W @ 500 LFM - Aluminum
HSE-B630-04H

HSE-B630-04H

HEAT SINK, EXTRUSION, TO-220, 63

CUI Devices

2,868 -
HSE-B630-04H

Datenblatt

Box HSE Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 2.480 (63.00mm) 1.378 (35.00mm) - 1.000 (25.40mm) 14.4W @ 75°C 2.31°C/W @ 200 LFM 9.37°C/W Aluminum Alloy
HSE-B18381-0396H

HSE-B18381-0396H

HEAT SINK, EXTRUSION, TO-218, 38

CUI Devices

3,622 -
HSE-B18381-0396H

Datenblatt

Box HSE Active Board Level, Vertical Bolt On and PC Pin Rectangular, Angled Fins 1.500 (38.10mm) 1.654 (42.00mm) - 0.984 (25.00mm) 10.8W @ 75°C 2.29°C/W @ 200 LFM 6.94°C/W Aluminum Alloy
677-10ABP

677-10ABP

HEATSINK MULTIWATT 1.0 BLK

Wakefield-Vette

3,506 -
677-10ABP

Datenblatt

Bulk 677 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.000 (25.40mm) 1.650 (41.91mm) - 1.000 (25.40mm) 6.0W @ 52°C 3.10°C/W @ 200 LFM 8.70°C/W Aluminum
642-35ABT3

642-35ABT3

HEAT SINK WITH THERMAL TAPE

Wakefield-Vette

2,666 -
642-35ABT3

Datenblatt

Bulk 642 Active Top Mount Thermal Tape, Adhesive (Included) Square, Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.350 (8.89mm) - 8.00°C/W @ 400 LFM - Aluminum
667-10ABSP

667-10ABSP

HEATSINK TO-220 W/S/O PINS BLK

Wakefield-Vette

2,812 -
667-10ABSP

Datenblatt

Bulk 667 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 0.500 (12.70mm) 1.375 (34.93mm) - 1.000 (25.40mm) 6.0W @ 76°C 5.80°C/W @ 200 LFM - Aluminum
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