Thermische Kühlkörper

制造商 Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
625-45ABT3

625-45ABT3

HEATSINK CPU 25MM SQ W/DBL TAPE

Wakefield-Vette

2,680 -
625-45ABT3

Datenblatt

Bulk 625 Active Top Mount Adhesive Square, Pin Fins 0.984 (25.00mm) 0.984 (25.00mm) - 0.450 (11.43mm) - 8.00°C/W @ 400 LFM - Aluminum
624-35ABT4E

624-35ABT4E

HEATSINK FOR 21MM BGA

Wakefield-Vette

2,895 -
624-35ABT4E

Datenblatt

Bulk 624 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 0.827 (21.00mm) 0.827 (21.00mm) - 0.350 (8.89mm) - 15.00°C/W @ 400 LFM - Aluminum
642-60ABT5

642-60ABT5

HEATSINK FOR 35MM BGA

Wakefield-Vette

2,435 -
642-60ABT5

Datenblatt

Bulk 642 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.600 (15.24mm) - 6.00°C/W @ 300 LFM - Aluminum
626-25ABPE

626-25ABPE

HEATSINK FOR TO218/TO220

Wakefield-Vette

3,491 -
626-25ABPE

Datenblatt

Bulk 626 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 0.500 (12.70mm) 1.375 (34.93mm) - 2.500 (63.50mm) 6.0W @ 48°C 4.20°C/W @ 200 LFM - Aluminum
630-60ABT1E

630-60ABT1E

HEATSINK FOR 35MM BGA

Wakefield-Vette

2,148 -
630-60ABT1E

Datenblatt

Bulk 630 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.600 (15.24mm) - 3.00°C/W @ 350 LFM - Aluminum
658-45ABT1E

658-45ABT1E

HEATSINK CPU 28MM SQBLK W/O TAPE

Wakefield-Vette

2,270 -
658-45ABT1E

Datenblatt

Bulk 658 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.100 (27.94mm) 1.100 (27.94mm) - 0.450 (11.43mm) 3.0W @ 50°C 6.00°C/W @ 200 LFM - Aluminum
667-15ABSPE

667-15ABSPE

HEATSINK TO-220 W/S/O PINS BLK

Wakefield-Vette

2,903 -
667-15ABSPE

Datenblatt

Bulk 667 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 0.500 (12.70mm) 1.375 (34.93mm) - 1.500 (38.10mm) 6.0W @ 66°C 5.50°C/W @ 200 LFM - Aluminum
625-25ABT5

625-25ABT5

HEATSINK FOR 25MM BGA

Wakefield-Vette

3,706 -
625-25ABT5

Datenblatt

Bulk 625 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 0.984 (25.00mm) 0.984 (25.00mm) - 0.250 (6.35mm) - 12.00°C/W @ 500 LFM - Aluminum
530714B05300G

530714B05300G

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation

3,820 -
530714B05300G

Datenblatt

Bulk - Active Board Level Bolt On and PC Pin Rectangular, Fins 0.710 (18.03mm) 0.955 (24.26mm) - 0.500 (12.70mm) 2.0W @ 40°C 4.00°C/W @ 700 LFM 20.30°C/W Aluminum
610-35AB

610-35AB

HEATSINK FOR BGA

Wakefield-Vette

3,984 -
610-35AB

Datenblatt

Bulk 610 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.240 (31.50mm) 1.240 (31.50mm) - 0.350 (8.89mm) - - - Aluminum
7021B-MT6G

7021B-MT6G

HEAT SINK

Aavid, Thermal Division of Boyd Corporation

2,458 -
7021B-MT6G

Datenblatt

Bulk - Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.750 (44.45mm) 1.450 (36.83mm) - 0.380 (9.65mm) 6.0W @ 50°C 4.00°C/W @ 300 LFM 6.80°C/W Aluminum
624-60ABT5

624-60ABT5

HEATSINK FOR 21MM BGA

Wakefield-Vette

2,338 -
624-60ABT5

Datenblatt

Bulk 624 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 0.827 (21.00mm) 0.827 (21.00mm) - 0.600 (15.24mm) - 1.00°C/W @ 400 LFM - Aluminum
667-15ABPPE

667-15ABPPE

HEATSINK TO-220 W/S/O PINS BLK

Wakefield-Vette

2,318 -
667-15ABPPE

Datenblatt

Bulk 667 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 0.500 (12.70mm) 1.375 (34.93mm) - 1.500 (38.10mm) 6.0W @ 66°C 5.50°C/W @ 200 LFM - Aluminum
630-60ABT5

630-60ABT5

HEATSINK FOR 35MM BGA

Wakefield-Vette

2,573 -
630-60ABT5

Datenblatt

Bulk 630 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.600 (15.24mm) - 3.00°C/W @ 350 LFM - Aluminum
630-60ABT3

630-60ABT3

HEATSINK FOR 35MM BGA

Wakefield-Vette

3,913 -
630-60ABT3

Datenblatt

Bulk 630 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.600 (15.24mm) - 3.00°C/W @ 350 LFM - Aluminum
625-35ABT4E

625-35ABT4E

HEATSINK FOR 25MM BGA

Wakefield-Vette

3,848 -
625-35ABT4E

Datenblatt

Bulk 625 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 0.984 (25.00mm) 0.984 (25.00mm) - 0.350 (8.89mm) - 1.00°C/W @ 400 LFM - Aluminum
630-45ABT5

630-45ABT5

HEATSINK FOR 35MM BGA

Wakefield-Vette

3,498 -
630-45ABT5

Datenblatt

Bulk 630 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.450 (11.43mm) - 4.00°C/W @ 400 LFM - Aluminum
574602B00000G

574602B00000G

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation

3,947 -
574602B00000G

Datenblatt

Bulk - Active Board Level Clip Rectangular, Fins 0.690 (17.53mm) 0.860 (21.84mm) - 0.395 (10.03mm) 3.0W @ 60°C 6.00°C/W @ 600 LFM 21.60°C/W Aluminum
626-20ABPE

626-20ABPE

HEATSINK FOR TO218/TO220

Wakefield-Vette

3,240 -
626-20ABPE

Datenblatt

Bulk 626 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 0.500 (12.70mm) 1.375 (34.93mm) - 2.000 (50.80mm) 6.0W @ 55°C 4.70°C/W @ 200 LFM - Aluminum
658-25ABT5

658-25ABT5

HEATSINK CPU 28MM SQ BLK W/TAPE

Wakefield-Vette

2,361 -
658-25ABT5

Datenblatt

Bulk 658 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.100 (27.94mm) 1.100 (27.94mm) - 0.250 (6.35mm) 2.0W @ 40°C 5.00°C/W @ 500 LFM - Aluminum
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