Thermische Kühlkörper

制造商 Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
BDN10-5CB/A01

BDN10-5CB/A01

HEATSINK CPU W/ADHESIVE 1.01SQ

CTS Thermal Management Products

3,325 -
BDN10-5CB/A01

Datenblatt

Tray BDN Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.010 (25.65mm) 1.010 (25.65mm) - 0.555 (14.10mm) - 6.30°C/W @ 400 LFM 20.80°C/W Aluminum
628-65ABT5

628-65ABT5

HEATSINK CPU 43MM SQ BLK H=.65

Wakefield-Vette

3,190 -
628-65ABT5

Datenblatt

Bulk 628 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.750 (44.45mm) 1.700 (43.18mm) - 0.650 (16.51mm) 3.0W @ 20°C 2.00°C/W @ 400 LFM - Aluminum
628-65ABT4E

628-65ABT4E

HEATSINK FOR 45MM BGA

Wakefield-Vette

3,975 -
628-65ABT4E

Datenblatt

Bulk 628 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.750 (44.45mm) 1.700 (43.18mm) - 0.650 (16.51mm) 3.0W @ 20°C 2.00°C/W @ 400 LFM - Aluminum
508222B00000

508222B00000

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation

2,307 -
508222B00000

Datenblatt

Bulk - Active Board Level Bolt On Rectangular, Fins 1.780 (45.21mm) 1.780 (45.21mm) - 1.000 (25.40mm) 9.0W @ 50°C 1.00°C/W @ 900 LFM 7.40°C/W Aluminum
657-10ABPESC

657-10ABPESC

HEATSINK TO-220 W/PINS BLK 1

Wakefield-Vette

3,609 -
657-10ABPESC

Datenblatt

Bulk 657 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.000 (25.40mm) 1.650 (41.91mm) - 1.000 (25.40mm) 6.0W @ 41°C 3.70°C/W @ 200 LFM - Aluminum
575300B00000G

575300B00000G

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation

3,125 -
575300B00000G

Datenblatt

Bulk - Active Top Mount Press Fit Rectangular, Fins 0.602 (15.29mm) - - 1.049 (26.64mm) 0.6W @ 30°C 25.00°C/W @ 100 LFM 50.00°C/W Aluminum
667-25ABSPE

667-25ABSPE

HEATSINK TO-220 W/S/O PINS BLK

Wakefield-Vette

2,798 -
667-25ABSPE

Datenblatt

Bulk 667 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 0.500 (12.70mm) 1.375 (34.93mm) - 2.500 (63.50mm) 6.0W @ 48°C 4.20°C/W @ 200 LFM - Aluminum
576012B00000G

576012B00000G

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation

2,612 -
576012B00000G

Datenblatt

Bulk - Active Board Level Bolt On Rectangular, Fins 0.900 (22.86mm) 1.000 (25.40mm) - 0.380 (9.65mm) 2.0W @ 40°C 4.00°C/W @ 700 LFM 20.80°C/W Aluminum
VRV-27-101E

VRV-27-101E

HEATSINK 27MM DEGREASED

Ohmite

2,670 -
VRV-27-101E

Datenblatt

Box VR Active Board Level, Vertical Clip and PC Pin Rectangular, Fins 1.063 (27.00mm) 1.335 (33.90mm) - 1.555 (39.50mm) - - - Aluminum
677-25ABEP

677-25ABEP

HEATSINK MULTIWATT 2.5 BLK

Wakefield-Vette

3,511 -
677-25ABEP

Datenblatt

Bulk 677 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 2.500 (63.50mm) 1.650 (41.91mm) - 1.000 (25.40mm) 6.0W @ 35°C 2.20°C/W @ 200 LFM - Aluminum
527-24AB

527-24AB

HEATSINK DC/DC HALF BRICK VERT

Wakefield-Vette

3,547 -
527-24AB

Datenblatt

Bulk 527 Active Board Level Bolt On, Thermal Material Rectangular, Fins 2.280 (57.91mm) 2.400 (60.96mm) - 0.950 (24.13mm) 5.0W @ 60°C 4.20°C/W @ 300 LFM - Aluminum
662-15AB

662-15AB

HEATSINK EXTRUSION 45MM

Wakefield-Vette

3,201 -
662-15AB

Datenblatt

Bulk 662 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.713 (43.51mm) 1.713 (43.51mm) - 0.150 (3.81mm) 2.0W @ 30°C 8.00°C/W @ 200 LFM - Aluminum
BDN12-3CB/A01

BDN12-3CB/A01

HEATSINK CPU W/ADHESIVE 1.21SQ

CTS Thermal Management Products

3,362 -
BDN12-3CB/A01

Datenblatt

Tray BDN Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.210 (30.73mm) 1.210 (30.73mm) - 0.355 (9.02mm) - 6.80°C/W @ 400 LFM 19.60°C/W Aluminum
6399B-P2G

6399B-P2G

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation

3,211 -
6399B-P2G

Datenblatt

Bulk - Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 2.000 (50.80mm) 1.650 (41.91mm) - 1.000 (25.40mm) 8.0W @ 40°C 1.00°C/W @ 700 LFM 3.30°C/W Aluminum
VXV-35-101E

VXV-35-101E

EXTRUDED HEATSINK 35MM

Ohmite

3,966 -
VXV-35-101E

Datenblatt

Box VX Active Board Level Bolt On Rectangular, Angled Fins 1.917 (48.70mm) 1.380 (35.05mm) - 1.100 (27.94mm) - - - Aluminum
677-20ABPE

677-20ABPE

HEATSINK MULTIWATT 2.0 BLK

Wakefield-Vette

2,197 -
677-20ABPE

Datenblatt

Bulk 677 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 2.000 (50.80mm) 1.650 (41.91mm) - 1.000 (25.40mm) 6.0W @ 40°C 2.50°C/W @ 200 LFM 6.70°C/W Aluminum
574004B00000G

574004B00000G

HEATSINK TO-202 CLIP-ON .58 BK

Aavid, Thermal Division of Boyd Corporation

3,085 -
574004B00000G

Datenblatt

Bag - Active Board Level Clip Rectangular 0.800 (20.32mm) 0.577 (14.66mm) - 0.250 (6.35mm) 1.0W @ 30°C 4.00°C/W @ 600 LFM 28.00°C/W Aluminum
628-65ABT1E

628-65ABT1E

HEATSINK FOR 45MM BGA

Wakefield-Vette

2,838 -
628-65ABT1E

Datenblatt

Bulk 628 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.750 (44.45mm) 1.700 (43.18mm) - 0.650 (16.51mm) 3.0W @ 20°C 2.00°C/W @ 400 LFM - Aluminum
657-15ABPESC

657-15ABPESC

HEATSINK TO-220 W/PINS BLK 1.5

Wakefield-Vette

2,933 -
657-15ABPESC

Datenblatt

Bulk 657 Active Board Level, Vertical Clip and PC Pin Rectangular, Fins 1.000 (25.40mm) 1.650 (41.91mm) - 1.500 (38.10mm) 6.0W @ 38°C 3.30°C/W @ 200 LFM - Aluminum
628-40ABT4E

628-40ABT4E

HEATSINK FOR 45MM BGA

Wakefield-Vette

2,152 -
628-40ABT4E

Datenblatt

Bulk 628 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.750 (44.45mm) 1.700 (43.18mm) - 4.000 (101.60mm) 2.5W @ 30°C 4.00°C/W @ 300 LFM - Aluminum
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