Thermische Kühlkörper

制造商 Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
D10850-40T3

D10850-40T3

HEATSINK 128PQFP COMPOSITE

Wakefield-Vette

3,778 -
D10850-40T3

Datenblatt

Bulk Deltem™ Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 0.850 (21.59mm) 0.850 (21.59mm) - 0.400 (10.16mm) 2.5W @ 90°C 20.00°C/W @ 100 LFM - Composite
325705R00000G

325705R00000G

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation

3,840 -
325705R00000G

Datenblatt

Bulk - Active Board Level Press Fit Cylindrical - - 0.318 (8.07mm) ID, 0.500 (12.70mm) OD 0.250 (6.35mm) 1.0W @ 60°C 35.00°C/W @ 200 LFM 60.00°C/W Aluminum
576203B00000G

576203B00000G

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation

3,869 -
576203B00000G

Datenblatt

Bulk - Active Board Level Bolt On Square, Pin Fins 1.810 (45.97mm) 1.810 (45.97mm) - 0.750 (19.05mm) 4.0W @ 30°C 2.50°C/W @ 400 LFM 6.20°C/W Aluminum
657-25ABPESC

657-25ABPESC

HEATSINK TO-220 W/PINS BLK 2.5

Wakefield-Vette

3,825 -
657-25ABPESC

Datenblatt

Bulk 657 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.000 (25.40mm) 1.650 (41.91mm) - 2.500 (63.50mm) 6.0W @ 25°C 2.70°C/W @ 200 LFM - Aluminum
1542500-1

1542500-1

HTS795-1=HS UPLTD

TE Connectivity AMP Connectors

3,519 -
Bag * Active - - - - - - - - - - -
655-53ABT6

655-53ABT6

HEATSINK FOR 40MM BGA

Wakefield-Vette

2,118 -
655-53ABT6

Datenblatt

Bulk 655 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.600 (40.64mm) 1.600 (40.64mm) - 0.525 (13.34mm) 4.0W @ 40°C 2.00°C/W @ 400 LFM - Aluminum
BDN15-3CB/A01

BDN15-3CB/A01

HEATSINK CPU W/ADHESIVE 1.51SQ

CTS Thermal Management Products

2,034 -
BDN15-3CB/A01

Datenblatt

Tray BDN Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.510 (38.35mm) 1.510 (38.35mm) - 0.355 (9.02mm) - 4.50°C/W @ 400 LFM 15.10°C/W Aluminum
655-53ABT3

655-53ABT3

HEATSINK FOR 40MM BGA

Wakefield-Vette

3,815 -
655-53ABT3

Datenblatt

Bulk 655 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.600 (40.64mm) 1.600 (40.64mm) - 0.525 (13.34mm) 4.0W @ 40°C 2.00°C/W @ 400 LFM - Aluminum
655-53ABT5

655-53ABT5

HEATSINK FOR 40MM BGA

Wakefield-Vette

2,972 -
655-53ABT5

Datenblatt

Bulk 655 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.600 (40.64mm) 1.600 (40.64mm) - 0.525 (13.34mm) 4.0W @ 40°C 2.00°C/W @ 400 LFM - Aluminum
527-24AB-T725

527-24AB-T725

HEATSINK DC/DC HALF BRICK VERT

Wakefield-Vette

3,418 -
527-24AB-T725

Datenblatt

Bulk 527 Active Board Level Bolt On, Thermal Material Rectangular, Fins 2.280 (57.91mm) 2.400 (60.96mm) - 0.950 (24.13mm) 5.0W @ 60°C 4.20°C/W @ 300 LFM - Aluminum
6045B

6045B

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation

2,172 -
6045B

Datenblatt

Bulk - Active Board Level Clip Rectangular 1.000 (25.40mm) 0.750 (19.05mm) - 0.350 (8.89mm) 1.0W @ 30°C 16.00°C/W @ 200 LFM 26.00°C/W Aluminum
500303B00000G

500303B00000G

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation

2,604 -
500303B00000G

Datenblatt

Bulk - Active Board Level Bolt On Square, Pin Fins 1.810 (45.97mm) 1.810 (45.97mm) - 1.000 (25.40mm) 6.0W @ 40°C 1.50°C/W @ 700 LFM 5.80°C/W Aluminum
530400B00100G

530400B00100G

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation

2,507 -
530400B00100G

Datenblatt

Bulk - Active Board Level, Vertical Bolt On and Board Mounts Square, Angled Fins 1.750 (44.45mm) 0.490 (12.44mm) - 1.750 (44.45mm) 4.0W @ 30°C 2.00°C/W @ 400 LFM 6.30°C/W Aluminum
533102B02551G

533102B02551G

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation

2,723 -
533102B02551G

Datenblatt

Bulk - Active Board Level, Vertical Clip and PC Pin Rectangular, Fins 1.500 (38.10mm) 1.375 (34.93mm) - 0.500 (12.70mm) 8.0W @ 80°C 3.00°C/W @ 500 LFM 11.00°C/W Aluminum
CR301-25AE

CR301-25AE

ALUMINUM HEATSINK 25MM BLK ANODI

Ohmite

2,094 -
CR301-25AE

Datenblatt

Box CR Active Board Level, Vertical 2 Clips and PC Pin Rectangular, Fins 0.984 (25.00mm) 2.362 (60.00mm) - - - - 8.10°C/W Aluminum Alloy
657-20ABPESC

657-20ABPESC

HEATSINK TO-220 W/PINS BLK 2

Wakefield-Vette

2,302 -
657-20ABPESC

Datenblatt

Bulk 657 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.000 (25.40mm) 1.650 (41.91mm) - 2.000 (50.80mm) 6.0W @ 32°C 2.90°C/W @ 200 LFM - Aluminum
530801B05150G

530801B05150G

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation

3,227 -
530801B05150G

Datenblatt

Bulk - Active Board Level, Vertical Clip and PC Pin Rectangular, Fins 1.840 (46.74mm) 0.490 (12.44mm) - 1.750 (44.45mm) 4.0W @ 30°C 1.00°C/W @ 700 LFM 6.30°C/W Aluminum
7137DG

7137DG

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation

3,229 -
7137DG

Datenblatt

Bulk - Active Board Level, Vertical Clip and PC Pin Rectangular, Fins 0.848 (21.55mm) 0.900 (22.86mm) - 0.375 (9.52mm) 1.5W @ 50°C 10.00°C/W @ 200 LFM 20.80°C/W Copper
527-24AB-ME

527-24AB-ME

HEATSINK DC/DC HALF BRICK VERT

Wakefield-Vette

2,462 -
527-24AB-ME

Datenblatt

Bulk 527 Active Board Level Bolt On, Thermal Material Rectangular, Fins 2.280 (57.91mm) 2.400 (60.96mm) - 0.950 (24.13mm) 5.0W @ 60°C 4.20°C/W @ 300 LFM - Aluminum
341600F00000G

341600F00000G

HEATSINK

Aavid, Thermal Division of Boyd Corporation

2,625 -
341600F00000G

Datenblatt

Bulk - Active - - - - - - - - - - -
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