Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
614-87-210-31-012101

614-87-210-31-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,742 -
614-87-210-31-012101

Datenblatt

Bulk 614 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-314-10-002101

110-87-314-10-002101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

3,567 -
110-87-314-10-002101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7), 8 Loaded 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-318-41-005101

110-87-318-41-005101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

3,608 -
110-87-318-41-005101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-318-41-605101

110-87-318-41-605101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

3,341 -
110-87-318-41-605101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-304-41-004101

116-83-304-41-004101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

3,880 -
116-83-304-41-004101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
04-0518-10T

04-0518-10T

CONN SOCKET SIP 4POS GOLD

Aries Electronics

3,376 -
04-0518-10T

Datenblatt

Bulk 518 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-1518-10T

04-1518-10T

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

3,239 -
04-1518-10T

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
01-0508-20

01-0508-20

CONN SOCKET SIP 1POS GOLD

Aries Electronics

2,070 -
01-0508-20

Datenblatt

Bulk 508 Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
01-0508-30

01-0508-30

CONN SOCKET SIP 1POS GOLD

Aries Electronics

2,632 -
01-0508-30

Datenblatt

Bulk 508 Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
116-83-306-41-007101

116-83-306-41-007101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

2,950 -
116-83-306-41-007101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-322-41-001101

110-87-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2,853 -
110-87-322-41-001101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-314-10-001101

110-83-314-10-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

3,418 -
110-83-314-10-001101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-322-41-001151

110-87-322-41-001151

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2,528 -
Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-610-41-018101

116-87-610-41-018101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,386 -
116-87-610-41-018101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
540-88-032-17-400

540-88-032-17-400

CONN SOCKET PLCC 32POS TIN

Preci-Dip

2,345 -
540-88-032-17-400

Datenblatt

Bulk 540 Active PLCC 32 (4 x 8) 0.050 (1.27mm) Tin - Phosphor Bronze Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS)
116-87-308-41-007101

116-87-308-41-007101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

2,567 -
116-87-308-41-007101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-310-31-012101

614-87-310-31-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,803 -
614-87-310-31-012101

Datenblatt

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-610-31-012101

614-87-610-31-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,312 -
614-87-610-31-012101

Datenblatt

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-308-41-006101

116-83-308-41-006101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

3,152 -
116-83-308-41-006101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-316-41-001101

115-87-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

3,825 -
Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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