Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-87-210-01-839101

110-87-210-01-839101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,277 -
110-87-210-01-839101

Datenblatt

Bulk 110 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5), 8 Loaded 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AW 127-36/Z-T

AW 127-36/Z-T

SOCKET 36 CONTACTS SINGLE ROW

Assmann WSW Components

3,896 -
AW 127-36/Z-T

Datenblatt

- - Active - - - - - - - - - - - - - -
110-87-316-41-605101

110-87-316-41-605101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2,646 -
110-87-316-41-605101

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-316-41-005101

110-87-316-41-005101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

3,545 -
110-87-316-41-005101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-020-05-001101

510-87-020-05-001101

CONN SOCKET PGA 20POS GOLD

Preci-Dip

3,787 -
510-87-020-05-001101

Datenblatt

Bulk 510 Active PGA 20 (5 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
02-0513-10H

02-0513-10H

CONN SOCKET SIP 2POS GOLD

Aries Electronics

2,301 -
02-0513-10H

Datenblatt

Bulk 0513 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-0518-10

04-0518-10

CONN SOCKET SIP 4POS GOLD

Aries Electronics

2,142 -
04-0518-10

Datenblatt

Bulk 518 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-1518-10

04-1518-10

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

3,806 -
04-1518-10

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
03-0513-10T

03-0513-10T

CONN SOCKET SIP 3POS GOLD

Aries Electronics

2,604 -
03-0513-10T

Datenblatt

Bulk 0513 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
03-0518-10H

03-0518-10H

CONN SOCKET SIP 3POS GOLD

Aries Electronics

3,604 -
03-0518-10H

Datenblatt

Bulk 518 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
AW 127-37/Z-T

AW 127-37/Z-T

SOCKET 37 CONTACTS SINGLE ROW

Assmann WSW Components

2,208 -
AW 127-37/Z-T

Datenblatt

- - Active - - - - - - - - - - - - - -
612-87-310-41-001101

612-87-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,227 -
612-87-310-41-001101

Datenblatt

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-610-41-001101

612-87-610-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,512 -
612-87-610-41-001101

Datenblatt

Bulk 612 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-308-41-012101

116-87-308-41-012101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

3,877 -
116-87-308-41-012101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
WMS-240Z

WMS-240Z

CONN IC DIP SOCKET 24POS GOLD

On Shore Technology Inc.

3,851 -
WMS-240Z

Datenblatt

Tube WMS Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, Wash Away Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass -
110-83-210-41-005101

110-83-210-41-005101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,622 -
110-83-210-41-005101

Datenblatt

Bulk 110 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-310-41-005101

110-83-310-41-005101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,556 -
110-83-310-41-005101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AW 127-38/Z-T

AW 127-38/Z-T

SOCKET 38 CONTACTS SINGLE ROW

Assmann WSW Components

3,915 -
AW 127-38/Z-T

Datenblatt

- - Active - - - - - - - - - - - - - -
03-0513-10

03-0513-10

CONN SOCKET SIP 3POS GOLD

Aries Electronics

3,905 -
03-0513-10

Datenblatt

Bulk 0513 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
03-0518-11

03-0518-11

CONN SOCKET SIP 3POS GOLD

Aries Electronics

3,783 -
03-0518-11

Datenblatt

Bulk 518 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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