Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
04-0513-10

04-0513-10

CONN SOCKET SIP 4POS GOLD

Aries Electronics

3,142 -
04-0513-10

Datenblatt

Bulk 0513 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-1518-00

04-1518-00

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

2,896 -
04-1518-00

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-0518-11H

02-0518-11H

CONN SOCKET SIP 2POS GOLD

Aries Electronics

3,053 -
02-0518-11H

Datenblatt

Bulk 518 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-1518-11H

02-1518-11H

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

2,576 -
02-1518-11H

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-87-025-05-000101

510-87-025-05-000101

CONN SOCKET PGA 25POS GOLD

Preci-Dip

3,723 -
510-87-025-05-000101

Datenblatt

Bulk 510 Active PGA 25 (5 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-316-41-117101

114-87-316-41-117101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2,888 -
114-87-316-41-117101

Datenblatt

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-308-41-008101

116-87-308-41-008101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

3,272 -
116-87-308-41-008101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-312-01-680101

110-83-312-01-680101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

3,695 -
110-83-312-01-680101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6), 6 Loaded 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-312-41-006101

116-87-312-41-006101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

2,657 -
116-87-312-41-006101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-306-41-009101

116-83-306-41-009101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

2,200 -
116-83-306-41-009101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DILB42P-223TLF

DILB42P-223TLF

CONN IC DIP SOCKET 42POS TINLEAD

Amphenol ICC (FCI)

3,029 -
DILB42P-223TLF

Datenblatt

Tube DILB Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon
WMS-2810Z

WMS-2810Z

CONN IC DIP SOCKET 28POS GOLD

On Shore Technology Inc.

2,547 -
WMS-2810Z

Datenblatt

Tube WMS Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, Wash Away Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass -
116-83-308-41-003101

116-83-308-41-003101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

3,646 -
116-83-308-41-003101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ED044PLCZ

ED044PLCZ

CONN SOCKET PLCC 44POS TIN

On Shore Technology Inc.

2,590 -
ED044PLCZ

Datenblatt

Tube ED Active PLCC 44 (2 x 22) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT)
115-87-316-41-003101

115-87-316-41-003101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2,011 -
115-87-316-41-003101

Datenblatt

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-312-41-134191

114-87-312-41-134191

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

2,284 -
Tape & Reel (TR),Cut Tape (CT) 114 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-320-41-005101

110-87-320-41-005101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3,390 -
110-87-320-41-005101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-320-41-605101

110-87-320-41-605101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2,095 -
110-87-320-41-605101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-420-41-005101

110-87-420-41-005101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2,308 -
110-87-420-41-005101

Datenblatt

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-312-41-005101

110-83-312-41-005101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

3,252 -
110-83-312-41-005101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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