Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
714-43-106-31-018000

714-43-106-31-018000

CONN SOCKET SIP 6POS GOLD

Mill-Max Manufacturing Corp.

505 -
714-43-106-31-018000

Datenblatt

Bulk 714 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
ICF-308-T-O-TR

ICF-308-T-O-TR

CONN IC DIP SOCKET 8POS TIN

Samtec Inc.

187 -
ICF-308-T-O-TR

Datenblatt

Tape & Reel (TR),Cut Tape (CT) iCF Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
346-93-109-41-013000

346-93-109-41-013000

CONN SOCKET SIP 9POS GOLD

Mill-Max Manufacturing Corp.

241 -
346-93-109-41-013000

Datenblatt

Bulk 346 Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
1571552-6

1571552-6

CONN IC DIP SOCKET 20POS TIN

TE Connectivity AMP Connectors

573 -
1571552-6

Datenblatt

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
BU080Z-178-HT

BU080Z-178-HT

CONN IC DIP SOCKET 8POS GOLD

On Shore Technology Inc.

3,091 -
BU080Z-178-HT

Datenblatt

Tube BU-178HT Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 78.7µin (2.00µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Copper Flash Brass Polybutylene Terephthalate (PBT), Glass Filled
110-43-316-10-005000

110-43-316-10-005000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

285 -
110-43-316-10-005000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8), 8 Loaded 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-424-41-001000

110-93-424-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

142 -
110-93-424-41-001000

Datenblatt

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-108-31-018000

714-43-108-31-018000

CONN SOCKET SIP 8POS GOLD

Mill-Max Manufacturing Corp.

536 -
714-43-108-31-018000

Datenblatt

Tube 714 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
820-AG11D-ESL-LF

820-AG11D-ESL-LF

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors

298 -
820-AG11D-ESL-LF

Datenblatt

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
ICF-316-T-O-TR

ICF-316-T-O-TR

CONN IC DIP SOCKET 16POS TIN

Samtec Inc.

3,225 -
ICF-316-T-O-TR

Datenblatt

Tape & Reel (TR),Cut Tape (CT) iCF Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
110-43-328-10-001000

110-43-328-10-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

233 -
110-43-328-10-001000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14), 16 Loaded 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-93-116-41-013000

346-93-116-41-013000

CONN SOCKET SIP 16POS GOLD

Mill-Max Manufacturing Corp.

130 -
346-93-116-41-013000

Datenblatt

Bulk 346 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-424-41-003000

115-43-424-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

488 -
115-43-424-41-003000

Datenblatt

Tube 115 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-43-316-41-005000

117-43-316-41-005000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

194 -
117-43-316-41-005000

Datenblatt

Tube 117 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-648-41-003000

115-43-648-41-003000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

3,426 -
115-43-648-41-003000

Datenblatt

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-316-11-001000

299-93-316-11-001000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

2,416 -
299-93-316-11-001000

Datenblatt

Tube 299 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-13-318-41-801000

110-13-318-41-801000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

3,756 -
110-13-318-41-801000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-43-316-41-801000

123-43-316-41-801000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

3,422 -
123-43-316-41-801000

Datenblatt

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-616-10-002000

299-43-616-10-002000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

3,913 -
299-43-616-10-002000

Datenblatt

Tube 299 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-640-31-012000

614-43-640-31-012000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

2,747 -
614-43-640-31-012000

Datenblatt

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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