Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
256-1292-00-0602J

256-1292-00-0602J

CONN IC DIP SOCKET ZIF 56POS GLD

3M

3,668 -
256-1292-00-0602J

Datenblatt

Bulk Textool™ Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 56 (2 x 28) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
228-7396-55-1902

228-7396-55-1902

CONN SOCKET SOIC 28POS GOLD

3M

2,129 -
228-7396-55-1902

Datenblatt

Bulk Textool™ Active SOIC 28 (2 x 14) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled
232-2601-00-0602

232-2601-00-0602

CONN SOCKET SIP ZIF 32POS GOLD

3M

3,913 -
232-2601-00-0602

Datenblatt

Bulk Textool™ Active SIP, ZIF (ZIP) 32 (1 x 32) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
240-5205-00

240-5205-00

CONN SOCKET QFN 40POS GOLD

3M

2,877 -
240-5205-00

Datenblatt

Bulk Textool™ Active QFN 40 (4 x 10) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polyethersulfone (PES)
216-5205-01

216-5205-01

CONN SOCKET QFN 16POS GOLD

3M

3,165 -
216-5205-01

Datenblatt

Bulk Textool™ Active QFN 16 (3x3) 0.020 (0.50mm) Gold - Beryllium Copper Through Hole - Solder - Gold - Beryllium Copper Polyethersulfone (PES)
248-4205-01

248-4205-01

CONN SOCKET QFN 48POS GOLD

3M

2,386 -
248-4205-01

Datenblatt

Bulk Textool™ Active QFN 48 (4 x 12) 0.016 (0.40mm) Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polyethersulfone (PES)
115-43-318-41-003000

115-43-318-41-003000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

140 -
115-43-318-41-003000

Datenblatt

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-47-121-41-005000

317-47-121-41-005000

CONN SOCKET SIP 21POS GOLD

Mill-Max Manufacturing Corp.

514 -
317-47-121-41-005000

Datenblatt

Tube 317 Active SIP 21 (1 x 21) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-318-41-001000

115-43-318-41-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

128 -
115-43-318-41-001000

Datenblatt

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-47-314-41-001000

123-47-314-41-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

3,696 -
123-47-314-41-001000

Datenblatt

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-93-624-41-001000

210-93-624-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

700 -
210-93-624-41-001000

Datenblatt

Tube 210 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-320-41-003000

115-43-320-41-003000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

2,579 -
115-43-320-41-003000

Datenblatt

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
214-99-624-01-670800

214-99-624-01-670800

CONN IC DIP SOCKET 24POS TINLEAD

Mill-Max Manufacturing Corp.

481 -
214-99-624-01-670800

Datenblatt

Tube 214 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-324-41-001000

115-43-324-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

117 -
115-43-324-41-001000

Datenblatt

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-93-324-41-001000

115-93-324-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

2,476 -
115-93-324-41-001000

Datenblatt

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-93-624-41-001000

115-93-624-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

2,168 -
115-93-624-41-001000

Datenblatt

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
214-99-628-01-670800

214-99-628-01-670800

CONN IC DIP SOCKET 28POS TINLEAD

Mill-Max Manufacturing Corp.

2,695 -
214-99-628-01-670800

Datenblatt

Tube 214 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-314-31-012000

614-43-314-31-012000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

260 -
614-43-314-31-012000

Datenblatt

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-950-41-001000

110-47-950-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

3,237 -
110-47-950-41-001000

Datenblatt

Tube 110 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
AR 28-HZL/07-TT

AR 28-HZL/07-TT

CONN IC DIP SOCKET 28POS GOLD

Assmann WSW Components

3,405 -
AR 28-HZL/07-TT

Datenblatt

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
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