Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
117-43-652-41-005000

117-43-652-41-005000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

3,022 -
117-43-652-41-005000

Datenblatt

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-93-624-41-801000

123-93-624-41-801000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

3,653 -
123-93-624-41-801000

Datenblatt

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
506-AG10D

506-AG10D

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors

2,953 -
506-AG10D

Datenblatt

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 25.0µin (0.63µm) Brass -
25-0511-10

25-0511-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

2,340 -
25-0511-10

Datenblatt

Tube 511 Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
APA-628-G-A1

APA-628-G-A1

ADAPTER PLUG

Samtec Inc.

3,141 -
Bulk APA Active - 28 (2 x 14) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
28-823-90C

28-823-90C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,707 -
28-823-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6574-10

24-6574-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

3,925 -
24-6574-10

Datenblatt

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
FMC05DRTN-S1682

FMC05DRTN-S1682

CONN TRANSIST TO-220/TO-247 5POS

Sullins Connector Solutions

2,681 -
FMC05DRTN-S1682

Datenblatt

Tray - Active Transistor, TO-220 and TO-247 5 (Rectangular) - Gold 30.0µin (0.76µm) Nickel Boron Through Hole - Solder - Gold 30.0µin (0.76µm) Nickel Boron Polyphenylene Sulfide (PPS)
111-93-210-41-001000

111-93-210-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

3,792 -
111-93-210-41-001000

Datenblatt

Tube 111 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-314-41-105000

110-93-314-41-105000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

2,332 -
110-93-314-41-105000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-420-41-001000

110-93-420-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

658 -
110-93-420-41-001000

Datenblatt

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
848-AG10D

848-AG10D

CONN IC DIP SOCKET 48POS GOLD

TE Connectivity AMP Connectors

2,842 -
848-AG10D

Datenblatt

Tube 800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - Copper Alloy Polyester
115-47-628-41-001000

115-47-628-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

2,892 -
115-47-628-41-001000

Datenblatt

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-41-428-41-001000

111-41-428-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,372 -
111-41-428-41-001000

Datenblatt

Tube 111 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-316-41-605000

110-93-316-41-605000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

3,343 -
110-93-316-41-605000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-432-41-001000

110-93-432-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

3,471 -
110-93-432-41-001000

Datenblatt

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-322-41-105000

110-93-322-41-105000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

3,565 -
110-93-322-41-105000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-93-628-41-005000

117-93-628-41-005000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

197 -
117-93-628-41-005000

Datenblatt

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-624-31-012000

614-43-624-31-012000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

3,873 -
614-43-624-31-012000

Datenblatt

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
8058-1G30

8058-1G30

CONN TRANSIST TO-5 4POS GOLD

TE Connectivity AMP Connectors

2,773 -
8058-1G30

Datenblatt

Bulk 8058 Obsolete Transistor, TO-5 4 (Round) - Gold - Beryllium Copper Panel Mount Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE)
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