Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
28-6513-10H

28-6513-10H

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,509 -
28-6513-10H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
33-0511-10

33-0511-10

CONN SOCKET SIP 33POS TIN

Aries Electronics

2,878 -
33-0511-10

Datasheet

Bulk 511 Active SIP 33 (1 x 33) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-0518-11H

32-0518-11H

CONN SOCKET SIP 32POS GOLD

Aries Electronics

2,862 -
32-0518-11H

Datasheet

Bulk 518 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-1518-11H

32-1518-11H

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,678 -
32-1518-11H

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6518-111

32-6518-111

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,803 -
32-6518-111

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-0503-20

16-0503-20

CONN SOCKET SIP 16POS GOLD

Aries Electronics

2,274 -
16-0503-20

Datasheet

Bulk 0503 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
16-0503-30

16-0503-30

CONN SOCKET SIP 16POS GOLD

Aries Electronics

2,136 -
16-0503-30

Datasheet

Bulk 0503 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
37-0518-00

37-0518-00

CONN SOCKET SIP 37POS GOLD

Aries Electronics

3,859 -
37-0518-00

Datasheet

Bulk 518 Active SIP 37 (1 x 37) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-6513-11

40-6513-11

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3,464 -
40-6513-11

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
26-3513-11

26-3513-11

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

2,610 -
26-3513-11

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
29-0511-10

29-0511-10

CONN SOCKET SIP 29POS TIN

Aries Electronics

3,353 -
29-0511-10

Datasheet

Bulk 511 Active SIP 29 (1 x 29) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-4513-11H

22-4513-11H

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

2,369 -
22-4513-11H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-3503-20

18-3503-20

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,783 -
18-3503-20

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-3503-30

18-3503-30

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,808 -
18-3503-30

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-0511-10

40-0511-10

CONN SOCKET SIP 40POS TIN

Aries Electronics

3,692 -
40-0511-10

Datasheet

Bulk 511 Active SIP 40 (1 x 40) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-822-90T

14-822-90T

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

2,789 -
14-822-90T

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
18-6820-90TWR

18-6820-90TWR

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

3,682 -
18-6820-90TWR

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
36-6513-11

36-6513-11

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

3,729 -
36-6513-11

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-0508-20

20-0508-20

CONN SOCKET SIP 20POS GOLD

Aries Electronics

3,579 -
20-0508-20

Datasheet

Bulk 508 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
20-0508-30

20-0508-30

CONN SOCKET SIP 20POS GOLD

Aries Electronics

3,980 -
20-0508-30

Datasheet

Bulk 508 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
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