Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
50-9513-10

50-9513-10

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

3,847 -
50-9513-10

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
21-0517-90C

21-0517-90C

CONN SOCKET SIP 21POS GOLD

Aries Electronics

3,871 -
21-0517-90C

Datasheet

Bulk 0517 Active SIP 21 (1 x 21) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-6501-20

22-6501-20

CONN IC DIP SOCKET 22POS TIN

Aries Electronics

3,761 -
22-6501-20

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-6501-30

22-6501-30

CONN IC DIP SOCKET 22POS TIN

Aries Electronics

2,149 -
22-6501-30

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
09-0501-20

09-0501-20

CONN SOCKET SIP 9POS TIN

Aries Electronics

3,462 -
09-0501-20

Datasheet

Bulk 501 Active SIP 9 (1 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
09-0501-30

09-0501-30

CONN SOCKET SIP 9POS TIN

Aries Electronics

2,862 -
09-0501-30

Datasheet

Bulk 501 Active SIP 9 (1 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-820-90T

16-820-90T

RT ANGLE 16 PIN SKT .1 INCH CTR

Aries Electronics

3,040 -
- Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
14-823-90C

14-823-90C

IC SOCKET 14PIN VERT SCKT HORIZ

Aries Electronics

3,425 -
- Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-3518-01

16-3518-01

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,006 -
16-3518-01

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-3518-112

28-3518-112

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,754 -
28-3518-112

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-6518-112

28-6518-112

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,752 -
28-6518-112

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-6823-90T

16-6823-90T

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

2,499 -
16-6823-90T

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
16-822-90T

16-822-90T

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

2,237 -
16-822-90T

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
14-4820-90C

14-4820-90C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3,690 -
14-4820-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.4 (10.16mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-4823-90C

14-4823-90C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3,740 -
14-4823-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.4 (10.16mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-6820-90C

14-6820-90C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3,628 -
14-6820-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-6822-90C

14-6822-90C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2,919 -
14-6822-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-6823-90C

14-6823-90C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3,711 -
14-6823-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-820-90C

14-820-90C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3,799 -
14-820-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-822-90C

14-822-90C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3,861 -
14-822-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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