Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
10-8433-610C

10-8433-610C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,648 -
10-8433-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8440-610C

10-8440-610C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,164 -
10-8440-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8470-610C

10-8470-610C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,877 -
10-8470-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8545-610C

10-8545-610C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3,893 -
10-8545-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
03-71250-10

03-71250-10

CONN SOCKET SIP 3POS TIN

Aries Electronics

2,736 -
03-71250-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 3 (1 x 3) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
03-7360-10

03-7360-10

CONN SOCKET SIP 3POS TIN

Aries Electronics

2,225 -
03-7360-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 3 (1 x 3) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
03-7630-10

03-7630-10

CONN SOCKET SIP 3POS TIN

Aries Electronics

2,914 -
03-7630-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 3 (1 x 3) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
03-7880-10

03-7880-10

CONN SOCKET SIP 3POS TIN

Aries Electronics

3,895 -
03-7880-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 3 (1 x 3) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-0503-21

10-0503-21

CONN SOCKET SIP 10POS GOLD

Aries Electronics

2,733 -
10-0503-21

Datasheet

Bulk 0503 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
10-0503-31

10-0503-31

CONN SOCKET SIP 10POS GOLD

Aries Electronics

3,981 -
10-0503-31

Datasheet

Bulk 0503 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
24-6501-20

24-6501-20

CONN IC DIP SOCKET 24POS TIN

Aries Electronics

3,705 -
24-6501-20

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-6501-30

24-6501-30

CONN IC DIP SOCKET 24POS TIN

Aries Electronics

2,580 -
24-6501-30

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
31-0518-11H

31-0518-11H

CONN SOCKET SIP 31POS GOLD

Aries Electronics

3,613 -
31-0518-11H

Datasheet

Bulk 518 Active SIP 31 (1 x 31) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
35-0511-10

35-0511-10

CONN SOCKET SIP 35POS TIN

Aries Electronics

2,133 -
35-0511-10

Datasheet

Bulk 511 Active SIP 35 (1 x 35) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
31-0511-10

31-0511-10

CONN SOCKET SIP 31POS TIN

Aries Electronics

3,086 -
31-0511-10

Datasheet

Bulk 511 Active SIP 31 (1 x 31) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
19-0508-20

19-0508-20

CONN SOCKET SIP 19POS GOLD

Aries Electronics

3,244 -
19-0508-20

Datasheet

Bulk 508 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
19-0508-30

19-0508-30

CONN SOCKET SIP 19POS GOLD

Aries Electronics

2,962 -
19-0508-30

Datasheet

Bulk 508 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
40-6518-102

40-6518-102

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3,079 -
40-6518-102

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-C182-11

24-C182-11

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,752 -
24-C182-11

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-C212-11

24-C212-11

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,870 -
24-C212-11

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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