Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
30-6501-30

30-6501-30

CONN IC DIP SOCKET 30POS TIN

Aries Electronics

2,540 -
30-6501-30

Datenblatt

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
01-0518-00

01-0518-00

CONN SOCKET SIP 1POS GOLD

Aries Electronics

2,197 -
01-0518-00

Datenblatt

Bulk 518 Active SIP 1 (1 x 1) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
36-0518-11H

36-0518-11H

CONN SOCKET SIP 36POS GOLD

Aries Electronics

3,365 -
36-0518-11H

Datenblatt

Bulk 518 Active SIP 36 (1 x 36) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
36-1518-11H

36-1518-11H

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

2,236 -
36-1518-11H

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-4503-30

22-4503-30

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3,082 -
22-4503-30

Datenblatt

Bulk 503 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
714-43-234-31-018000

714-43-234-31-018000

CONN IC DIP SOCKET 34POS GOLD

Mill-Max Manufacturing Corp.

2,702 -
714-43-234-31-018000

Datenblatt

Bulk 714 Active DIP, 0.1 (2.54mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
12-7350-10

12-7350-10

CONN SOCKET SIP 12POS TIN

Aries Electronics

2,263 -
12-7350-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 12 (1 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
12-7435-10

12-7435-10

CONN SOCKET SIP 12POS TIN

Aries Electronics

3,210 -
12-7435-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 12 (1 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
12-7500-10

12-7500-10

CONN SOCKET SIP 12POS TIN

Aries Electronics

3,263 -
12-7500-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 12 (1 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
12-7550-10

12-7550-10

CONN SOCKET SIP 12POS TIN

Aries Electronics

2,682 -
12-7550-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 12 (1 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
12-7590-10

12-7590-10

CONN SOCKET SIP 12POS TIN

Aries Electronics

3,622 -
12-7590-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 12 (1 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
12-7750-10

12-7750-10

CONN SOCKET SIP 12POS TIN

Aries Electronics

2,064 -
12-7750-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 12 (1 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-0508-20

22-0508-20

CONN SOCKET SIP 22POS GOLD

Aries Electronics

3,454 -
22-0508-20

Datenblatt

Bulk 508 Active SIP 22 (1 x 22) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
22-0508-30

22-0508-30

CONN SOCKET SIP 22POS GOLD

Aries Electronics

3,079 -
22-0508-30

Datenblatt

Bulk 508 Active SIP 22 (1 x 22) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
22-1508-20

22-1508-20

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3,032 -
22-1508-20

Datenblatt

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
22-1508-30

22-1508-30

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3,922 -
22-1508-30

Datenblatt

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
10-0501-31

10-0501-31

CONN SOCKET SIP 10POS GOLD

Aries Electronics

2,517 -
10-0501-31

Datenblatt

Bulk 501 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
510-83-207-17-082101

510-83-207-17-082101

CONN SOCKET PGA 207POS GOLD

Preci-Dip

2,816 -
510-83-207-17-082101

Datenblatt

Bulk 510 Active PGA 207 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-632-T-N

APA-632-T-N

ADAPTER PLUG

Samtec Inc.

2,530 -
Tube APA Active - 32 (2 x 16) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
10-6810-90TWR

10-6810-90TWR

CONN IC DIP SOCKET 10POS TIN

Aries Electronics

2,203 -
10-6810-90TWR

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
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