Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
16-822-90

16-822-90

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,951 -
16-822-90

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
24-0517-90C

24-0517-90C

CONN SOCKET SIP 24POS GOLD

Aries Electronics

3,592 -
24-0517-90C

Datenblatt

Bulk 0517 Active SIP 24 (1 x 24) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-640-41-013101

116-83-640-41-013101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

3,108 -
116-83-640-41-013101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
14-822-90TWR

14-822-90TWR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

2,765 -
14-822-90TWR

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
14-823-90WR

14-823-90WR

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2,498 -
14-823-90WR

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
16-820-90WR

16-820-90WR

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,195 -
16-820-90WR

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
10-6810-90

10-6810-90

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3,482 -
10-6810-90

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
346-93-156-41-013000

346-93-156-41-013000

CONN SOCKET SIP 56POS GOLD

Mill-Max Manufacturing Corp.

2,825 -
346-93-156-41-013000

Datenblatt

Bulk 346 Active SIP 56 (1 x 56) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-156-41-013000

346-43-156-41-013000

CONN SOCKET SIP 56POS GOLD

Mill-Max Manufacturing Corp.

3,680 -
346-43-156-41-013000

Datenblatt

Bulk 346 Active SIP 56 (1 x 56) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-83-636-10-002101

299-83-636-10-002101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3,926 -
299-83-636-10-002101

Datenblatt

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
5-6437504-0

5-6437504-0

CONN TRANSIST TO-3 3POS SILVER

TE Connectivity AMP Connectors

2,589 -
Bulk,Box 8080 Active Transistor, TO-3 3 (Oval) - Silver - Beryllium Copper Chassis Mount Closed Frame Solder - Silver - Beryllium Copper Diallyl Phthalate (DAP)
510-83-210-17-061101

510-83-210-17-061101

CONN SOCKET PGA 210POS GOLD

Preci-Dip

3,168 -
510-83-210-17-061101

Datenblatt

Bulk 510 Active PGA 210 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
13-0503-21

13-0503-21

CONN SOCKET SIP 13POS GOLD

Aries Electronics

2,073 -
13-0503-21

Datenblatt

Bulk 0503 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
13-0503-31

13-0503-31

CONN SOCKET SIP 13POS GOLD

Aries Electronics

2,859 -
13-0503-31

Datenblatt

Bulk 0503 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
20-0503-20

20-0503-20

CONN SOCKET SIP 20POS GOLD

Aries Electronics

2,077 -
20-0503-20

Datenblatt

Bulk 0503 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
20-0503-30

20-0503-30

CONN SOCKET SIP 20POS GOLD

Aries Electronics

3,809 -
20-0503-30

Datenblatt

Bulk 0503 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
20-3518-01

20-3518-01

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,814 -
20-3518-01

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-4518-01

20-4518-01

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,643 -
20-4518-01

Datenblatt

Bulk 518 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-822-90E

20-822-90E

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

2,774 -
20-822-90E

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
714-43-138-31-018000

714-43-138-31-018000

CONN SOCKET SIP 38POS GOLD

Mill-Max Manufacturing Corp.

3,942 -
714-43-138-31-018000

Datenblatt

Bulk 714 Active SIP 38 (1 x 38) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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