Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
28-6501-30

28-6501-30

CONN IC DIP SOCKET 28POS TIN

Aries Electronics

3,326 -
28-6501-30

Datenblatt

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
28-6501-20

28-6501-20

CONN IC DIP SOCKET 28POS TIN

Aries Electronics

3,604 -
28-6501-20

Datenblatt

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
06-71187-10

06-71187-10

CONN SOCKET SIP 6POS TIN

Aries Electronics

2,040 -
06-71187-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 6 (1 x 6) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
06-7360-10

06-7360-10

CONN SOCKET SIP 6POS TIN

Aries Electronics

3,390 -
06-7360-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 6 (1 x 6) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
06-7425-10

06-7425-10

CONN SOCKET SIP 6POS TIN

Aries Electronics

2,829 -
06-7425-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 6 (1 x 6) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
06-7755-10

06-7755-10

CONN SOCKET SIP 6POS TIN

Aries Electronics

3,974 -
06-7755-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 6 (1 x 6) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
28-3513-11

28-3513-11

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,384 -
28-3513-11

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
64-9513-10T

64-9513-10T

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics

3,000 -
64-9513-10T

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6518-11H

24-6518-11H

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,845 -
24-6518-11H

Datenblatt

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-87-280-19-081101

510-87-280-19-081101

CONN SOCKET PGA 280POS GOLD

Preci-Dip

3,228 -
510-87-280-19-081101

Datenblatt

Bulk 510 Active PGA 280 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-281-19-081101

510-87-281-19-081101

CONN SOCKET PGA 281POS GOLD

Preci-Dip

3,603 -
510-87-281-19-081101

Datenblatt

Bulk 510 Active PGA 281 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-13-640-41-001000

123-13-640-41-001000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

2,331 -
123-13-640-41-001000

Datenblatt

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
10-3503-21

10-3503-21

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,846 -
10-3503-21

Datenblatt

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-3503-31

10-3503-31

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3,237 -
10-3503-31

Datenblatt

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
11-0508-21

11-0508-21

CONN SOCKET SIP 11POS GOLD

Aries Electronics

3,645 -
11-0508-21

Datenblatt

Bulk 508 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
11-0508-31

11-0508-31

CONN SOCKET SIP 11POS GOLD

Aries Electronics

2,516 -
11-0508-31

Datenblatt

Bulk 508 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
12-81250-310C

12-81250-310C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

3,644 -
12-81250-310C

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-8312-310C

12-8312-310C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

2,671 -
12-8312-310C

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-8355-310C

12-8355-310C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

2,424 -
12-8355-310C

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-8358-310C

12-8358-310C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

2,105 -
12-8358-310C

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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