Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
346-43-148-41-013000

346-43-148-41-013000

CONN SOCKET SIP 48POS GOLD

Mill-Max Manufacturing Corp.

3,308 -
346-43-148-41-013000

Datenblatt

Bulk 346 Active SIP 48 (1 x 48) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-83-180-15-002101

510-83-180-15-002101

CONN SOCKET PGA 180POS GOLD

Preci-Dip

3,011 -
510-83-180-15-002101

Datenblatt

Bulk 510 Active PGA 180 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-180-15-041101

510-83-180-15-041101

CONN SOCKET PGA 180POS GOLD

Preci-Dip

3,133 -
510-83-180-15-041101

Datenblatt

Bulk 510 Active PGA 180 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-180-17-081101

510-83-180-17-081101

CONN SOCKET PGA 180POS GOLD

Preci-Dip

2,630 -
510-83-180-17-081101

Datenblatt

Bulk 510 Active PGA 180 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
24-C182-11

24-C182-11

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,752 -
24-C182-11

Datenblatt

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-C212-11

24-C212-11

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,870 -
24-C212-11

Datenblatt

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-C300-11

24-C300-11

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,093 -
24-C300-11

Datenblatt

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
27-0511-10

27-0511-10

CONN SOCKET SIP 27POS TIN

Aries Electronics

2,856 -
27-0511-10

Datenblatt

Bulk 511 Active SIP 27 (1 x 27) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
116-47-304-41-001000

116-47-304-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

3,000 -
116-47-304-41-001000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-11-304-41-001000

123-11-304-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,434 -
123-11-304-41-001000

Datenblatt

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-83-180-14-031101

510-83-180-14-031101

CONN SOCKET PGA 180POS GOLD

Preci-Dip

3,168 -
510-83-180-14-031101

Datenblatt

Bulk 510 Active PGA 180 (14 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-180-15-001101

510-83-180-15-001101

CONN SOCKET PGA 180POS GOLD

Preci-Dip

2,538 -
510-83-180-15-001101

Datenblatt

Bulk 510 Active PGA 180 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
08-2503-21

08-2503-21

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,186 -
08-2503-21

Datenblatt

Bulk 503 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
08-2503-31

08-2503-31

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,315 -
08-2503-31

Datenblatt

Bulk 503 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
940-44-068-17-400004

940-44-068-17-400004

CONN SKT PLCC

Mill-Max Manufacturing Corp.

2,018 -
940-44-068-17-400004

Datenblatt

Tape & Reel (TR) 940 Active PLCC 68 (4 x 17) 0.050 (1.27mm) Tin 150.0µin (3.81µm) Beryllium Copper Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-83-181-17-082101

510-83-181-17-082101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

3,147 -
510-83-181-17-082101

Datenblatt

Bulk 510 Active PGA 181 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-181-14-031101

510-83-181-14-031101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

3,678 -
510-83-181-14-031101

Datenblatt

Bulk 510 Active PGA 181 (14 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-181-15-001101

510-83-181-15-001101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

2,948 -
510-83-181-15-001101

Datenblatt

Bulk 510 Active PGA 181 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-181-15-051101

510-83-181-15-051101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

3,708 -
510-83-181-15-051101

Datenblatt

Bulk 510 Active PGA 181 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-41-304-41-001000

116-41-304-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,694 -
116-41-304-41-001000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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