Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
10-8375-310C

10-8375-310C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,522 -
10-8375-310C

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8575-310C

10-8575-310C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3,440 -
10-8575-310C

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8620-310C

10-8620-310C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3,634 -
10-8620-310C

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8630-310C

10-8630-310C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3,851 -
10-8630-310C

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
ICO-628-MGT

ICO-628-MGT

CONN IC DIP SOCKET 28POS GOLD

Samtec Inc.

2,354 -
ICO-628-MGT

Datenblatt

Tube ICO Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
510-83-174-17-061101

510-83-174-17-061101

CONN SOCKET PGA 174POS GOLD

Preci-Dip

2,216 -
510-83-174-17-061101

Datenblatt

Bulk 510 Active PGA 174 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-174-17-081101

510-83-174-17-081101

CONN SOCKET PGA 174POS GOLD

Preci-Dip

2,019 -
510-83-174-17-081101

Datenblatt

Bulk 510 Active PGA 174 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
XR2A-6411-N

XR2A-6411-N

I.C. CONNECTOR SOCKET

Omron Electronics Inc-EMC Div

3,447 -
Bulk * Active - - - - - - - - - - - - - -
06-0501-21

06-0501-21

CONN SOCKET SIP 6POS GOLD

Aries Electronics

3,177 -
06-0501-21

Datenblatt

Bulk 501 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
06-0501-31

06-0501-31

CONN SOCKET SIP 6POS GOLD

Aries Electronics

3,545 -
06-0501-31

Datenblatt

Bulk 501 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
15-0503-20

15-0503-20

CONN SOCKET SIP 15POS GOLD

Aries Electronics

2,195 -
15-0503-20

Datenblatt

Bulk 0503 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
15-0503-30

15-0503-30

CONN SOCKET SIP 15POS GOLD

Aries Electronics

2,340 -
15-0503-30

Datenblatt

Bulk 0503 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
514-83-078-13-061117

514-83-078-13-061117

CONN SOCKET PGA 78POS GOLD

Preci-Dip

3,115 -
514-83-078-13-061117

Datenblatt

Bulk 514 Active PGA 78 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-648-41-004101

116-87-648-41-004101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2,555 -
116-87-648-41-004101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
20-4518-11H

20-4518-11H

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,431 -
20-4518-11H

Datenblatt

Bulk 518 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-0517-90C

20-0517-90C

CONN SOCKET SIP 20POS GOLD

Aries Electronics

3,489 -
20-0517-90C

Datenblatt

Bulk 0517 Active SIP 20 (1 x 20) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-83-175-16-072101

510-83-175-16-072101

CONN SOCKET PGA 175POS GOLD

Preci-Dip

3,153 -
510-83-175-16-072101

Datenblatt

Bulk 510 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-636-41-013101

116-87-636-41-013101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3,298 -
116-87-636-41-013101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-630-10-002101

299-83-630-10-002101

CONN IC DIP SOCKET 30POS GOLD

Preci-Dip

3,029 -
299-83-630-10-002101

Datenblatt

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-176-15-061101

510-83-176-15-061101

CONN SOCKET PGA 176POS GOLD

Preci-Dip

3,253 -
510-83-176-15-061101

Datenblatt

Bulk 510 Active PGA 176 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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