Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
06-3508-31

06-3508-31

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3,686 -
06-3508-31

Datenblatt

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-6823-90T

20-6823-90T

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

2,951 -
20-6823-90T

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
08-6823-90

08-6823-90

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,696 -
08-6823-90

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
10-81250-610C

10-81250-610C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3,627 -
10-81250-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8335-610C

10-8335-610C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3,048 -
10-8335-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8340-610C

10-8340-610C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,358 -
10-8340-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8433-610C

10-8433-610C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,648 -
10-8433-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8440-610C

10-8440-610C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,164 -
10-8440-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8470-610C

10-8470-610C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,877 -
10-8470-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8545-610C

10-8545-610C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3,893 -
10-8545-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-640-41-004101

116-83-640-41-004101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2,832 -
116-83-640-41-004101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-628-T-C

APA-628-T-C

ADAPTER PLUG

Samtec Inc.

2,483 -
Bulk APA Active - 28 (2 x 14) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
122-13-304-41-001000

122-13-304-41-001000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.

3,920 -
122-13-304-41-001000

Datenblatt

Tube 122 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-83-179-18-001101

510-83-179-18-001101

CONN SOCKET PGA 179POS GOLD

Preci-Dip

2,149 -
510-83-179-18-001101

Datenblatt

Bulk 510 Active PGA 179 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-179-18-111101

510-83-179-18-111101

CONN SOCKET PGA 179POS GOLD

Preci-Dip

2,986 -
510-83-179-18-111101

Datenblatt

Bulk 510 Active PGA 179 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-179-18-112101

510-83-179-18-112101

CONN SOCKET PGA 179POS GOLD

Preci-Dip

2,482 -
510-83-179-18-112101

Datenblatt

Bulk 510 Active PGA 179 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-179-18-113101

510-83-179-18-113101

CONN SOCKET PGA 179POS GOLD

Preci-Dip

3,453 -
510-83-179-18-113101

Datenblatt

Bulk 510 Active PGA 179 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ICF-324-S-O

ICF-324-S-O

.100 SURFACE MOUNT SCREW MACHIN

Samtec Inc.

3,819 -
Tube iCF Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
03-71250-10

03-71250-10

CONN SOCKET SIP 3POS TIN

Aries Electronics

2,736 -
03-71250-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 3 (1 x 3) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
03-7360-10

03-7360-10

CONN SOCKET SIP 3POS TIN

Aries Electronics

2,225 -
03-7360-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 3 (1 x 3) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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