Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
10-3503-20

10-3503-20

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3,044 -
10-3503-20

Datenblatt

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
510-87-184-17-081101

510-87-184-17-081101

CONN SOCKET PGA 184POS GOLD

Preci-Dip

3,375 -
510-87-184-17-081101

Datenblatt

Bulk 510 Active PGA 184 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
02-7450-10

02-7450-10

CONN SOCKET SIP 2POS TIN

Aries Electronics

3,741 -
02-7450-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 2 (1 x 2) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
02-7520-10

02-7520-10

CONN SOCKET SIP 2POS TIN

Aries Electronics

2,583 -
02-7520-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 2 (1 x 2) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
02-7540-10

02-7540-10

CONN SOCKET SIP 2POS TIN

Aries Electronics

3,691 -
02-7540-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 2 (1 x 2) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
02-7625-10

02-7625-10

CONN SOCKET SIP 2POS TIN

Aries Electronics

2,706 -
02-7625-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 2 (1 x 2) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-3518-102

16-3518-102

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,458 -
16-3518-102

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-820-90C

08-820-90C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,172 -
08-820-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-822-90C

08-822-90C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,484 -
08-822-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-823-90C

08-823-90C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,906 -
08-823-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
514-87-068-10-001117

514-87-068-10-001117

CONN SOCKET PGA 68POS GOLD

Preci-Dip

2,078 -
514-87-068-10-001117

Datenblatt

Bulk 514 Active PGA 68 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-068-10-061117

514-87-068-10-061117

CONN SOCKET PGA 68POS GOLD

Preci-Dip

3,670 -
514-87-068-10-061117

Datenblatt

Bulk 514 Active PGA 68 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-650-41-009101

116-87-650-41-009101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

2,117 -
116-87-650-41-009101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
714-43-120-31-018000

714-43-120-31-018000

CONN SOCKET SIP 20POS GOLD

Mill-Max Manufacturing Corp.

3,577 -
714-43-120-31-018000

Datenblatt

Tube 714 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
540-44-020-17-400004

540-44-020-17-400004

CONN SKT PLCC

Mill-Max Manufacturing Corp.

3,532 -
540-44-020-17-400004

Datenblatt

Tape & Reel (TR) 540 Active PLCC 20 (4 x 5) 0.050 (1.27mm) Tin 100.0µin (2.54µm) - Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS)
510-87-196-14-000101

510-87-196-14-000101

CONN SOCKET PGA 196POS GOLD

Preci-Dip

2,931 -
510-87-196-14-000101

Datenblatt

Bulk 510 Active PGA 196 (14 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
32-1518-11

32-1518-11

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,058 -
32-1518-11

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-3518-102

14-3518-102

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3,495 -
14-3518-102

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-820-90T

08-820-90T

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

3,302 -
08-820-90T

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
510-83-120-13-001101

510-83-120-13-001101

CONN SOCKET PGA 120POS GOLD

Preci-Dip

2,024 -
510-83-120-13-001101

Datenblatt

Bulk 510 Active PGA 120 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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