Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
11-0508-20

11-0508-20

CONN SOCKET SIP 11POS GOLD

Aries Electronics

2,221 -
11-0508-20

Datenblatt

Bulk 508 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
11-0508-30

11-0508-30

CONN SOCKET SIP 11POS GOLD

Aries Electronics

3,293 -
11-0508-30

Datenblatt

Bulk 508 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
16-3518-101H

16-3518-101H

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3,805 -
16-3518-101H

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-0517-90C

12-0517-90C

CONN SOCKET SIP 12POS GOLD

Aries Electronics

3,145 -
12-0517-90C

Datenblatt

Bulk 0517 Active SIP 12 (1 x 12) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
XR2C3215

XR2C3215

CONN SOCKET SIP 32POS GOLD

Omron Electronics Inc-EMC Div

2,308 -
XR2C3215

Datenblatt

Bulk XR2 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Threaded - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled
14-3518-10M

14-3518-10M

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2,107 -
14-3518-10M

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-6513-11

20-6513-11

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,612 -
20-6513-11

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-0513-11

20-0513-11

CONN SOCKET SIP 20POS GOLD

Aries Electronics

3,736 -
20-0513-11

Datenblatt

Bulk 0513 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
23-0513-10H

23-0513-10H

CONN SOCKET SIP 23POS GOLD

Aries Electronics

3,846 -
23-0513-10H

Datenblatt

Bulk 0513 Active SIP 23 (1 x 23) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-3518-00

28-3518-00

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,020 -
28-3518-00

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
38-0518-10H

38-0518-10H

CONN SOCKET SIP 38POS GOLD

Aries Electronics

2,565 -
38-0518-10H

Datenblatt

Bulk 518 Active SIP 38 (1 x 38) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
38-1518-10H

38-1518-10H

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

2,762 -
38-1518-10H

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
614-83-044-08-031112

614-83-044-08-031112

CONN SOCKET PGA 44POS GOLD

Preci-Dip

2,115 -
614-83-044-08-031112

Datenblatt

Bulk 614 Active PGA 44 (8 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-179-15-041101

510-87-179-15-041101

CONN SOCKET PGA 179POS GOLD

Preci-Dip

2,291 -
510-87-179-15-041101

Datenblatt

Bulk 510 Active PGA 179 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-179-18-001101

510-87-179-18-001101

CONN SOCKET PGA 179POS GOLD

Preci-Dip

3,110 -
510-87-179-18-001101

Datenblatt

Bulk 510 Active PGA 179 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-179-18-112101

510-87-179-18-112101

CONN SOCKET PGA 179POS GOLD

Preci-Dip

2,676 -
510-87-179-18-112101

Datenblatt

Bulk 510 Active PGA 179 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-179-18-113101

510-87-179-18-113101

CONN SOCKET PGA 179POS GOLD

Preci-Dip

2,048 -
510-87-179-18-113101

Datenblatt

Bulk 510 Active PGA 179 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-652-41-001101

121-83-652-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

2,215 -
121-83-652-41-001101

Datenblatt

Bulk 121 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
31-0518-11

31-0518-11

CONN SOCKET SIP 31POS GOLD

Aries Electronics

2,928 -
31-0518-11

Datenblatt

Bulk 518 Active SIP 31 (1 x 31) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-650-41-007101

116-87-650-41-007101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

3,998 -
116-87-650-41-007101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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