Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
122-83-652-41-001101

122-83-652-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

2,214 -
122-83-652-41-001101

Datenblatt

Bulk 122 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-652-41-001101

123-83-652-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

3,000 -
123-83-652-41-001101

Datenblatt

Bulk 123 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
28-3518-10TLH

28-3518-10TLH

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,356 -
28-3518-10TLH

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-87-184-15-001101

510-87-184-15-001101

CONN SOCKET PGA 184POS GOLD

Preci-Dip

2,782 -
510-87-184-15-001101

Datenblatt

Bulk 510 Active PGA 184 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
08-2511-11

08-2511-11

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,843 -
08-2511-11

Datenblatt

Bulk 511 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
12-0508-20

12-0508-20

CONN SOCKET SIP 12POS GOLD

Aries Electronics

3,868 -
12-0508-20

Datenblatt

Bulk 508 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
12-0508-30

12-0508-30

CONN SOCKET SIP 12POS GOLD

Aries Electronics

2,809 -
12-0508-30

Datenblatt

Bulk 508 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
12-1508-20

12-1508-20

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

2,444 -
12-1508-20

Datenblatt

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
12-1508-30

12-1508-30

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

3,790 -
12-1508-30

Datenblatt

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
APA-624-T-A1

APA-624-T-A1

ADAPTER PLUG

Samtec Inc.

3,620 -
Bulk APA Active - 24 (2 x 12) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
16-8430-10WR

16-8430-10WR

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

2,730 -
16-8430-10WR

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-0518-11

32-0518-11

CONN SOCKET SIP 32POS GOLD

Aries Electronics

2,789 -
32-0518-11

Datenblatt

Bulk 518 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
APA-316-G-J

APA-316-G-J

ADAPTER PLUG

Samtec Inc.

3,755 -
Tube APA Active - 16 (2 x 8) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
510-83-120-13-061101

510-83-120-13-061101

CONN SOCKET PGA 120POS GOLD

Preci-Dip

2,409 -
510-83-120-13-061101

Datenblatt

Bulk 510 Active PGA 120 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
32-6511-10

32-6511-10

CONN IC DIP SOCKET 32POS TIN

Aries Electronics

2,778 -
32-6511-10

Datenblatt

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
APA-320-T-M

APA-320-T-M

ADAPTER PLUG

Samtec Inc.

2,663 -
Tube APA Active - 20 (2 x 10) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
APA-324-T-A1

APA-324-T-A1

ADAPTER PLUG

Samtec Inc.

2,984 -
Bulk APA Active - 24 (2 x 12) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
299-83-620-10-002101

299-83-620-10-002101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2,929 -
299-83-620-10-002101

Datenblatt

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
22-6511-10

22-6511-10

CONN IC DIP SOCKET 22POS TIN

Aries Electronics

3,693 -
22-6511-10

Datenblatt

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
06-0508-21

06-0508-21

CONN SOCKET SIP 6POS GOLD

Aries Electronics

3,677 -
06-0508-21

Datenblatt

Bulk 508 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
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