Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-83-040-11-061101

510-83-040-11-061101

CONN SOCKET PGA 40POS GOLD

Preci-Dip

2,596 -
510-83-040-11-061101

Datenblatt

Bulk 510 Active PGA 40 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-318-41-008101

116-83-318-41-008101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

2,463 -
116-83-318-41-008101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
04-3513-11

04-3513-11

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

2,525 -
04-3513-11

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-0513-11H

06-0513-11H

CONN SOCKET SIP 6POS GOLD

Aries Electronics

3,238 -
06-0513-11H

Datenblatt

Bulk 0513 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
07-0513-11

07-0513-11

CONN SOCKET SIP 7POS GOLD

Aries Electronics

2,614 -
07-0513-11

Datenblatt

Bulk 0513 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
11-0518-11

11-0518-11

CONN SOCKET SIP 11POS GOLD

Aries Electronics

3,355 -
11-0518-11

Datenblatt

Bulk 518 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-0508-21

02-0508-21

CONN SOCKET SIP 2POS GOLD

Aries Electronics

2,936 -
02-0508-21

Datenblatt

Bulk 508 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
02-0508-31

02-0508-31

CONN SOCKET SIP 2POS GOLD

Aries Electronics

2,612 -
02-0508-31

Datenblatt

Bulk 508 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
02-1508-21

02-1508-21

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

2,255 -
02-1508-21

Datenblatt

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
02-1508-31

02-1508-31

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

3,438 -
02-1508-31

Datenblatt

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
06-3513-11

06-3513-11

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2,424 -
06-3513-11

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-3518-10T

24-3518-10T

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,807 -
24-3518-10T

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-322-41-009101

116-87-322-41-009101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3,761 -
116-87-322-41-009101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-422-41-009101

116-87-422-41-009101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3,385 -
116-87-422-41-009101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-318-41-011101

116-87-318-41-011101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

3,643 -
116-87-318-41-011101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-068-11-001101

510-87-068-11-001101

CONN SOCKET PGA 68POS GOLD

Preci-Dip

2,058 -
510-87-068-11-001101

Datenblatt

Bulk 510 Active PGA 68 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-068-11-061101

510-87-068-11-061101

CONN SOCKET PGA 68POS GOLD

Preci-Dip

3,361 -
510-87-068-11-061101

Datenblatt

Bulk 510 Active PGA 68 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-068-11-062101

510-87-068-11-062101

CONN SOCKET PGA 68POS GOLD

Preci-Dip

2,632 -
510-87-068-11-062101

Datenblatt

Bulk 510 Active PGA 68 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-068-10-001101

510-87-068-10-001101

CONN SOCKET PGA 68POS GOLD

Preci-Dip

3,076 -
510-87-068-10-001101

Datenblatt

Bulk 510 Active PGA 68 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-068-10-061101

510-87-068-10-061101

CONN SOCKET PGA 68POS GOLD

Preci-Dip

3,484 -
510-87-068-10-061101

Datenblatt

Bulk 510 Active PGA 68 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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