Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
832-AG11D-ESL

832-AG11D-ESL

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors

3,162 -
832-AG11D-ESL

Datenblatt

Tube 800 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 5.00µin (0.127µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead - Copper Alloy Polyester
114-83-324-41-134191

114-83-324-41-134191

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2,808 -
Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-87-324-41-001101

122-87-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2,555 -
122-87-324-41-001101

Datenblatt

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-87-424-41-001101

122-87-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2,352 -
122-87-424-41-001101

Datenblatt

Bulk 122 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-324-41-001101

123-87-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2,095 -
123-87-324-41-001101

Datenblatt

Bulk 123 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-424-41-001101

123-87-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3,419 -
123-87-424-41-001101

Datenblatt

Bulk 123 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-320-41-001101

121-83-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2,808 -
121-83-320-41-001101

Datenblatt

Bulk 121 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-420-41-012101

116-83-420-41-012101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3,784 -
116-83-420-41-012101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
16-0518-10

16-0518-10

CONN SOCKET SIP 16POS GOLD

Aries Electronics

2,498 -
16-0518-10

Datenblatt

Bulk 518 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-1518-10

16-1518-10

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3,135 -
16-1518-10

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
122-83-320-41-001101

122-83-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2,182 -
122-83-320-41-001101

Datenblatt

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-420-41-001101

122-83-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3,506 -
122-83-420-41-001101

Datenblatt

Bulk 122 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-320-41-001101

123-83-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2,983 -
123-83-320-41-001101

Datenblatt

Bulk 123 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-420-41-001101

123-83-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2,397 -
123-83-420-41-001101

Datenblatt

Bulk 123 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-628-41-105101

117-87-628-41-105101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,035 -
117-87-628-41-105101

Datenblatt

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-422-41-002101

116-87-422-41-002101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3,985 -
116-87-422-41-002101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-422-41-018101

116-83-422-41-018101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2,821 -
116-83-422-41-018101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-632-41-105161

110-87-632-41-105161

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2,149 -
110-87-632-41-105161

Datenblatt

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
4590

4590

CONN TRANSIST TO-5 3POS TIN

Keystone Electronics

2,282 -
4590

Datenblatt

Bulk - Active Transistor, TO-5 3 (Round) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polyester, Glass Filled
116-87-632-41-006101

116-87-632-41-006101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2,962 -
116-87-632-41-006101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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