Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-87-069-11-001101

510-87-069-11-001101

CONN SOCKET PGA 69POS GOLD

Preci-Dip

3,964 -
510-87-069-11-001101

Datenblatt

Bulk 510 Active PGA 69 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-069-11-061101

510-87-069-11-061101

CONN SOCKET PGA 69POS GOLD

Preci-Dip

2,934 -
510-87-069-11-061101

Datenblatt

Bulk 510 Active PGA 69 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ICF-316-T-I-TR

ICF-316-T-I-TR

.100 SURFACE MOUNT SCREW MACHIN

Samtec Inc.

2,780 -
Tape & Reel (TR),Cut Tape (CT) iCF Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
XR2C-1611-N

XR2C-1611-N

CONN SOCKET SIP 16POS GOLD

Omron Electronics Inc-EMC Div

3,098 -
XR2C-1611-N

Datenblatt

Bulk,Box XR2 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
146-87-324-41-035101

146-87-324-41-035101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3,151 -
146-87-324-41-035101

Datenblatt

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-648-41-005101

117-87-648-41-005101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2,458 -
117-87-648-41-005101

Datenblatt

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-632-41-003101

115-83-632-41-003101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2,837 -
115-83-632-41-003101

Datenblatt

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-312-10-001101

299-87-312-10-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

2,813 -
299-87-312-10-001101

Datenblatt

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
13-0513-10T

13-0513-10T

CONN SOCKET SIP 13POS GOLD

Aries Electronics

3,555 -
13-0513-10T

Datenblatt

Bulk 0513 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-0518-10H

14-0518-10H

CONN SOCKET SIP 14POS GOLD

Aries Electronics

3,335 -
14-0518-10H

Datenblatt

Bulk 518 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
614-83-628-41-001101

614-83-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,011 -
614-83-628-41-001101

Datenblatt

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
14-3513-10

14-3513-10

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2,047 -
14-3513-10

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-87-072-11-001101

510-87-072-11-001101

CONN SOCKET PGA 72POS GOLD

Preci-Dip

2,204 -
510-87-072-11-001101

Datenblatt

Bulk 510 Active PGA 72 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-072-11-041101

510-87-072-11-041101

CONN SOCKET PGA 72POS GOLD

Preci-Dip

2,877 -
510-87-072-11-041101

Datenblatt

Bulk 510 Active PGA 72 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-072-11-061101

510-87-072-11-061101

CONN SOCKET PGA 72POS GOLD

Preci-Dip

3,775 -
510-87-072-11-061101

Datenblatt

Bulk 510 Active PGA 72 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
08-6513-11

08-6513-11

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,245 -
08-6513-11

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-0513-10H

08-0513-10H

CONN SOCKET SIP 8POS GOLD

Aries Electronics

3,898 -
08-0513-10H

Datenblatt

Bulk 0513 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-320-41-012101

116-87-320-41-012101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2,757 -
116-87-320-41-012101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-310-10-001101

299-83-310-10-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,088 -
299-83-310-10-001101

Datenblatt

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-424-41-001101

612-83-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2,172 -
612-83-424-41-001101

Datenblatt

Bulk 612 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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