Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
04-0513-10H

04-0513-10H

CONN SOCKET SIP 4POS GOLD

Aries Electronics

3,881 -
04-0513-10H

Datenblatt

Bulk 0513 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-3518-00

06-3518-00

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3,285 -
06-3518-00

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
123-83-310-41-001101

123-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,783 -
123-83-310-41-001101

Datenblatt

Bulk 123 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-320-41-134191

114-87-320-41-134191

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2,061 -
Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-210-41-001101

614-83-210-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,955 -
614-83-210-41-001101

Datenblatt

Bulk 614 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-624-41-001101

110-87-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3,591 -
110-87-624-41-001101

Datenblatt

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-624-41-001151

110-87-624-41-001151

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2,093 -
Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
410-83-214-10-001101

410-83-214-10-001101

CONN ZIG-ZAG 14POS GOLD

Preci-Dip

3,688 -
410-83-214-10-001101

Datenblatt

Bulk 410 Active Zig-Zag 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
410-83-214-10-002101

410-83-214-10-002101

CONN ZIG-ZAG 14POS GOLD

Preci-Dip

2,165 -
410-83-214-10-002101

Datenblatt

Bulk 410 Active Zig-Zag 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-314-41-105191

110-87-314-41-105191

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

3,758 -
Tape & Reel (TR),Cut Tape (CT) 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AR 20-HZL/07-TT

AR 20-HZL/07-TT

CONN IC DIP SOCKET 20POS GOLD

Assmann WSW Components

2,295 -
AR 20-HZL/07-TT

Datenblatt

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
614-87-316-31-012101

614-87-316-31-012101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2,203 -
614-87-316-31-012101

Datenblatt

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-310-41-105191

110-83-310-41-105191

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,128 -
Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
540-88-044-17-400-TR

540-88-044-17-400-TR

CONN SOCKET PLCC 44POS TIN

Preci-Dip

2,032 -
540-88-044-17-400-TR

Datenblatt

Tape & Reel (TR) 540 Active PLCC 44 (4 x 11) 0.050 (1.27mm) Tin - Phosphor Bronze Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS)
AR 40-HZL/01-TT

AR 40-HZL/01-TT

CONN IC DIP SOCKET 40POS GOLD

Assmann WSW Components

3,778 -
AR 40-HZL/01-TT

Datenblatt

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
510-87-036-06-000101

510-87-036-06-000101

CONN SOCKET PGA 36POS GOLD

Preci-Dip

2,792 -
510-87-036-06-000101

Datenblatt

Bulk 510 Active PGA 36 (6 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-628-41-605101

110-87-628-41-605101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,626 -
110-87-628-41-605101

Datenblatt

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-428-41-005101

110-87-428-41-005101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,755 -
110-87-428-41-005101

Datenblatt

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-628-41-005101

110-87-628-41-005101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,897 -
110-87-628-41-005101

Datenblatt

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-328-01-762101

110-87-328-01-762101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,221 -
110-87-328-01-762101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14), 16 Loaded 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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