Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
410-87-220-10-001101

410-87-220-10-001101

CONN ZIG-ZAG 20POS GOLD

Preci-Dip

2,997 -
410-87-220-10-001101

Datenblatt

Bulk 410 Active Zig-Zag, Left Stackable 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
410-87-220-10-002101

410-87-220-10-002101

CONN ZIG-ZAG 20POS GOLD

Preci-Dip

3,191 -
410-87-220-10-002101

Datenblatt

Bulk 410 Active Zig-Zag, Right Stackable 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-210-41-009101

116-87-210-41-009101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,966 -
116-87-210-41-009101

Datenblatt

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-310-41-009101

116-87-310-41-009101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,255 -
116-87-310-41-009101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-87-312-41-001101

122-87-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

3,379 -
122-87-312-41-001101

Datenblatt

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-312-41-001101

123-87-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

3,127 -
123-87-312-41-001101

Datenblatt

Bulk 123 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-032-09-041101

510-87-032-09-041101

CONN SOCKET PGA 32POS GOLD

Preci-Dip

3,500 -
510-87-032-09-041101

Datenblatt

Bulk 510 Active PGA 32 (9 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-610-41-007101

116-87-610-41-007101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,119 -
116-87-610-41-007101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-316-41-005101

110-83-316-41-005101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2,097 -
110-83-316-41-005101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-316-41-105161

110-87-316-41-105161

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2,126 -
110-87-316-41-105161

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-316-41-006101

116-87-316-41-006101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2,337 -
116-87-316-41-006101

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AR 10-HZW/TN

AR 10-HZW/TN

CONN IC DIP SOCKET 4POS TIN

Assmann WSW Components

3,310 -
AR 10-HZW/TN

Datenblatt

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
8428-21A1-RK-TP

8428-21A1-RK-TP

CONN SOCKET PLCC 28POS TIN

3M

3,538 -
8428-21A1-RK-TP

Datenblatt

Tube 8400 Active PLCC 28 (4 x 7) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled
116-83-312-41-006101

116-83-312-41-006101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

3,762 -
116-83-312-41-006101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
346-93-104-41-013000

346-93-104-41-013000

CONN SOCKET SIP 4POS GOLD

Mill-Max Manufacturing Corp.

3,198 -
346-93-104-41-013000

Datenblatt

Tube 346 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-104-41-013000

346-43-104-41-013000

CONN SOCKET SIP 4POS GOLD

Mill-Max Manufacturing Corp.

2,194 -
346-43-104-41-013000

Datenblatt

Tube 346 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
ED084PLCZ-SM-N

ED084PLCZ-SM-N

CONN SOCKET PLCC 84POS

On Shore Technology Inc.

3,684 -
ED084PLCZ-SM-N

Datenblatt

Tube ED Active PLCC 84 (2x42) 0.050 (1.27mm) - - Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) - - Phosphor Bronze Polyphenylene Sulfide (PPS)
BU-20OZ

BU-20OZ

CONN IC DIP SOCKET 20POS

On Shore Technology Inc.

3,838 -
Tube BU Active - 20 (2 x 10) - - - - - - - - - - - -
116-87-210-41-012101

116-87-210-41-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,137 -
116-87-210-41-012101

Datenblatt

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-318-41-001101

110-83-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

3,171 -
110-83-318-41-001101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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