Foto | Herst. Teil # | Verfügbarkeit | Preis | Menge | Datenblatt | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
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110-87-306-41-001101CONN IC DIP SOCKET 6POS GOLD |
18,085 | - |
|
![]() Datenblatt |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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AR 06-HZL/01-TTCONN IC DIP SOCKET 6POS GOLD |
6,667 | - |
|
![]() Datenblatt |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
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A 20-LC-TRCONN IC DIP SOCKET 20POS TIN |
3,116 | - |
|
![]() Datenblatt |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
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A 24-LC/7-TCONN IC DIP SOCKET 24POS TIN |
2,300 | - |
|
![]() Datenblatt |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
|
SA083040CONN IC DIP SOCKET 8POS GOLD |
4,690 | - |
|
![]() Datenblatt |
Tube | SA | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 80.0µin (2.03µm) | Brass | Thermoplastic, Polyester, Glass Filled |
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A 28-LC-TRCONN IC DIP SOCKET 28POS TIN |
1,406 | - |
|
![]() Datenblatt |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
|
ED40DTCONN IC DIP SOCKET 40POS TIN |
11,060 | - |
|
![]() Datenblatt |
Tube | ED | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
SA083000CONN IC DIP SOCKET 8POS GOLD |
6,789 | - |
|
![]() Datenblatt |
Tube | SA | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Thermoplastic, Polyester, Glass Filled |
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SA103000CONN IC DIP SOCKET 10POS GOLD |
9,722 | - |
|
![]() Datenblatt |
Tube | SA | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Thermoplastic, Polyester, Glass Filled |
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A 32-LC-TTCONN IC DIP SOCKET 32POS TIN |
2,676 | - |
|
![]() Datenblatt |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
|
ICM-308-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 8P |
1,554 | - |
|
![]() Datenblatt |
Tube | ICM | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Polyphenylene Sulfide (PPS) |
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AR 08-HZL/01-TTCONN IC DIP SOCKET 8POS GOLD |
31,861 | - |
|
![]() Datenblatt |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
DILB14P-223TLFCONN IC DIP SOCKET 14POS TIN |
4,962 | - |
|
![]() Datenblatt |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Polyamide (PA), Nylon |
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A 22-LC-T2CONN IC DIP SOCKET 22POS TIN |
1,229 | - |
|
![]() Datenblatt |
Tube | - | Active | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
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AR 20-HZL-TTCONN IC DIP SOCKET 20POS TIN |
3,932 | - |
|
![]() Datenblatt |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
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245-24-1-06CONN IC DIP SOCKET 24POS TIN |
1,370 | - |
|
![]() Datenblatt |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole, Kinked Pin | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
1-2199298-6CONN IC DIP SOCKET 20POS TIN |
6,422 | - |
|
![]() Datenblatt |
Tube | Diplomate DL | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass, Copper | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled |
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110-44-308-41-001000CONN IC DIP SOCKET 8POS TIN |
4,466 | - |
|
![]() Datenblatt |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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110-99-308-41-001000CONN IC DIP SOCKET 8POS TIN-LEAD |
1,153 | - |
|
![]() Datenblatt |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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243-32-1-06CONN IC DIP SOCKET 32POS TIN |
1,229 | - |
|
![]() Datenblatt |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |