Foto | Herst. Teil # | Verfügbarkeit | Preis | Menge | Datenblatt | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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110-44-640-41-001000CONN IC DIP SOCKET 40POS TIN |
5,230 | - |
|
![]() Datenblatt |
Tube | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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940-44-044-24-000000CONN SOCKET PLCC 44POS TIN |
4,341 | - |
|
![]() Datenblatt |
Tube | 940 | Active | PLCC | 44 (4 x 11) | 0.100 (2.54mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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110-13-316-41-001000CONN IC DIP SOCKET 16POS GOLD |
14,219 | - |
|
![]() Datenblatt |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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540-44-032-17-400000CONN SOCKET PLCC 32POS TIN |
8,775 | - |
|
![]() Datenblatt |
Tube | 540 | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 150.0µin (3.81µm) | Copper Alloy | Polyphenylene Sulfide (PPS) |
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110-41-628-41-001000CONN IC DIP SOCKET 28POS GOLD |
3,780 | - |
|
![]() Datenblatt |
Tube | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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110-43-628-41-001000CONN IC DIP SOCKET 28POS GOLD |
136 | - |
|
![]() Datenblatt |
Tube | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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110-43-328-41-001000CONN IC DIP SOCKET 28POS GOLD |
2,787 | - |
|
![]() Datenblatt |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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940-44-052-24-000000CONN SOCKET PLCC 52POS TIN |
23,467 | - |
|
![]() Datenblatt |
Tube | 940 | Active | PLCC | 52 (4 x 13) | 0.100 (2.54mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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940-44-068-24-000000CONN SOCKET PLCC 68POS TIN |
5,488 | - |
|
![]() Datenblatt |
Tube | 940 | Active | PLCC | 68 (4 x 17) | 0.100 (2.54mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
110-43-632-41-001000CONN IC DIP SOCKET 32POS GOLD |
1,992 | - |
|
![]() Datenblatt |
Tube | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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115-93-328-41-001000CONN IC DIP SOCKET 28POS GOLD |
1,806 | - |
|
![]() Datenblatt |
Tube | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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110-13-324-41-001000CONN IC DIP SOCKET 24POS GOLD |
1,814 | - |
|
![]() Datenblatt |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
D01-9973242CONN SOCKET SIP 32POS GOLD |
14,048 | - |
|
![]() Datenblatt |
Tube | D01-997 | Active | SIP | 32 (1 x 32) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
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110-93-640-41-001000CONN IC DIP SOCKET 40POS GOLD |
3,280 | - |
|
![]() Datenblatt |
Tube | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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110-43-640-41-001000CONN IC DIP SOCKET 40POS GOLD |
1,961 | - |
|
![]() Datenblatt |
Tube | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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25-0513-10CONN SOCKET SIP 25POS GOLD |
3,170 | - |
|
![]() Datenblatt |
Bulk | 0513 | Active | SIP | 25 (1 x 25) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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40-0518-10CONN SOCKET SIP 40POS GOLD |
6,256 | - |
|
![]() Datenblatt |
Bulk | 518 | Active | SIP | 40 (1 x 40) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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299-43-314-10-001000CONN IC DIP SOCKET 14POS GOLD |
1,302 | - |
|
![]() Datenblatt |
Bulk | 299 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
D01-9953242CONN SOCKET SIP 32POS GOLD |
3,183 | - |
|
![]() Datenblatt |
Bulk | D01-995 | Active | SIP | 32 (1 x 32) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
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10-2810-90CONN IC DIP SOCKET 10POS GOLD |
1,272 | - |
|
![]() Datenblatt |
Bulk | Vertisockets™ 800 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Vertical | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 |