Foto | Herst. Teil # | Verfügbarkeit | Preis | Menge | Datenblatt | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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115-93-320-41-001000CONN IC DIP SOCKET 20POS GOLD |
121 | - |
|
![]() Datenblatt |
Tube | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
ICA-308-SGTCONN IC DIP SOCKET 8POS GOLD |
2,488 | - |
|
![]() Datenblatt |
Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyester, Glass Filled |
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111-93-320-41-001000CONN IC DIP SOCKET 20POS GOLD |
2,783 | - |
|
![]() Datenblatt |
Tube | 111 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
110-41-632-41-001000CONN IC DIP SOCKET 32POS GOLD |
2,597 | - |
|
![]() Datenblatt |
Tube | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
16-3513-10CONN IC DIP SOCKET 16POS GOLD |
3,991 | - |
|
![]() Datenblatt |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
110-47-648-41-001000CONN IC DIP SOCKET 48POS GOLD |
166 | - |
|
![]() Datenblatt |
Tube | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (1 x 24) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
110-47-328-41-105000CONN IC DIP SOCKET 28POS GOLD |
103 | - |
|
![]() Datenblatt |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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115-43-624-41-003000CONN IC DIP SOCKET 24POS GOLD |
177 | - |
|
![]() Datenblatt |
Tube | 115 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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917-93-210-41-005000CONN SOCKET TRANSIST TO100 10POS |
3,998 | - |
|
![]() Datenblatt |
Tube | 917 | Active | Transistor, TO-100 | 10 (Round) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
XR2A-1801-NCONN IC DIP SOCKET 18POS GOLD |
2,833 | - |
|
![]() Datenblatt |
Bulk | XR2 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
ICA-314-SSTCONN IC DIP SOCKET 14POS GOLD |
989 | - |
|
![]() Datenblatt |
Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 10.0µin (0.25µm) | Brass | Polyester, Glass Filled |
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D2924-42CONN IC DIP SOCKET 24POS GOLD |
2,150 | - |
|
![]() Datenblatt |
Tube | D2 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Plastic |
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123-93-314-41-001000CONN IC DIP SOCKET 14POS GOLD |
2,973 | - |
|
![]() Datenblatt |
Tube | 123 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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940-44-084-17-400000CONN SOCKET PLCC 84POS TIN |
452 | - |
|
![]() Datenblatt |
Tube | 940 | Active | PLCC | 84 (4 x 21) | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
ICA-628-STTCONN IC DIP SOCKET 28POS TIN |
3,577 | - |
|
![]() Datenblatt |
Tube | ICA | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled |
|
ICA-314-SGTCONN IC DIP SOCKET 14POS GOLD |
3,880 | - |
|
![]() Datenblatt |
Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 10.0µin (0.25µm) | Brass | Polyester, Glass Filled |
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D0816-42CONN IC DIP SOCKET 16POS GOLD |
2,725 | - |
|
![]() Datenblatt |
Bulk | D0 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
ICF-308-S-OCONN IC DIP SOCKET 8POS TIN |
3,649 | - |
|
![]() Datenblatt |
Tube | iCF | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) |
|
38340-PIN ZIF SOCKET |
3,158 | - |
|
![]() Datenblatt |
- | - | Active | DIP, ZIF (ZIP) | 40 (2 x 20) | - | Gold | - | - | Through Hole | Closed Frame | Solder | - | Gold | - | - | - |
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123-43-316-41-001000CONN IC DIP SOCKET 16POS GOLD |
2,315 | - |
|
![]() Datenblatt |
Tube | 123 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |