Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
33-0501-21

33-0501-21

CONN SOCKET SIP 33POS GOLD

Aries Electronics

3,489 -
33-0501-21

Datasheet

Bulk 501 Active SIP 33 (1 x 33) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
33-0501-31

33-0501-31

CONN SOCKET SIP 33POS GOLD

Aries Electronics

2,225 -
33-0501-31

Datasheet

Bulk 501 Active SIP 33 (1 x 33) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
28-0508-21

28-0508-21

CONN SOCKET SIP 28POS GOLD

Aries Electronics

2,659 -
28-0508-21

Datasheet

Bulk 508 Active SIP 28 (1 x 28) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
28-0508-31

28-0508-31

CONN SOCKET SIP 28POS GOLD

Aries Electronics

2,619 -
28-0508-31

Datasheet

Bulk 508 Active SIP 28 (1 x 28) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
28-1508-21

28-1508-21

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,319 -
28-1508-21

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
28-1508-31

28-1508-31

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,392 -
28-1508-31

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
160-PGM15050-10

160-PGM15050-10

CONN SOCKET PGA GOLD

Aries Electronics

2,896 -
160-PGM15050-10

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
160-PGM15056-10

160-PGM15056-10

CONN SOCKET PGA GOLD

Aries Electronics

2,666 -
160-PGM15056-10

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
64-9518-11H

64-9518-11H

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics

2,730 -
64-9518-11H

Datasheet

Bulk 518 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-6508-302

40-6508-302

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2,891 -
40-6508-302

Datasheet

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6621-30

32-6621-30

CONN IC DIP SOCKET 32POS TIN

Aries Electronics

2,863 -
32-6621-30

Datasheet

Bulk 6621 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
44-6556-11

44-6556-11

CONN IC DIP SOCKET 44POS GOLD

Aries Electronics

2,078 -
44-6556-11

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
22-6503-21

22-6503-21

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

2,639 -
22-6503-21

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-6503-31

22-6503-31

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3,482 -
22-6503-31

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-6503-21

24-6503-21

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,495 -
24-6503-21

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-6503-31

24-6503-31

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,026 -
24-6503-31

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
38-6823-90T

38-6823-90T

CONN IC DIP SOCKET 38POS TIN

Aries Electronics

2,942 -
38-6823-90T

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
28-0501-21

28-0501-21

CONN SOCKET SIP 28POS GOLD

Aries Electronics

3,321 -
28-0501-21

Datasheet

Bulk 501 Active SIP 28 (1 x 28) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
28-0501-31

28-0501-31

CONN SOCKET SIP 28POS GOLD

Aries Electronics

2,416 -
28-0501-31

Datasheet

Bulk 501 Active SIP 28 (1 x 28) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
37-0501-20

37-0501-20

CONN SOCKET SIP 37POS TIN

Aries Electronics

2,119 -
37-0501-20

Datasheet

Bulk 501 Active SIP 37 (1 x 37) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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