Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
48-3554-10

48-3554-10

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

3,668 -
48-3554-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6553-10

48-6553-10

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

2,519 -
48-6553-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6501-21

36-6501-21

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

2,409 -
36-6501-21

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
36-6501-31

36-6501-31

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

3,264 -
36-6501-31

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
30-6621-30

30-6621-30

CONN IC DIP SOCKET 30POS TIN

Aries Electronics

3,091 -
30-6621-30

Datasheet

Bulk 6621 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-4503-21

22-4503-21

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

2,413 -
22-4503-21

Datasheet

Bulk 503 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-4503-31

22-4503-31

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

2,795 -
22-4503-31

Datasheet

Bulk 503 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-0508-21

24-0508-21

CONN SOCKET SIP 24POS GOLD

Aries Electronics

2,735 -
24-0508-21

Datasheet

Bulk 508 Active SIP 24 (1 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
24-0508-31

24-0508-31

CONN SOCKET SIP 24POS GOLD

Aries Electronics

3,290 -
24-0508-31

Datasheet

Bulk 508 Active SIP 24 (1 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
24-1508-21

24-1508-21

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,244 -
24-1508-21

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
24-1508-31

24-1508-31

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,353 -
24-1508-31

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
38-6820-90C

38-6820-90C

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

3,355 -
38-6820-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
38-6822-90C

38-6822-90C

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

3,002 -
38-6822-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
38-6823-90C

38-6823-90C

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

2,947 -
38-6823-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-3508-212

20-3508-212

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,797 -
20-3508-212

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-3508-312

20-3508-312

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,597 -
20-3508-312

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
42-6556-11

42-6556-11

CONN IC DIP SOCKET 42POS GOLD

Aries Electronics

2,097 -
42-6556-11

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
32-0501-21

32-0501-21

CONN SOCKET SIP 32POS GOLD

Aries Electronics

3,398 -
32-0501-21

Datasheet

Bulk 501 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-0501-31

32-0501-31

CONN SOCKET SIP 32POS GOLD

Aries Electronics

2,698 -
32-0501-31

Datasheet

Bulk 501 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
36-6823-90T

36-6823-90T

CONN IC DIP SOCKET 36POS TIN

Aries Electronics

3,297 -
36-6823-90T

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
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