Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
27-7530-10

27-7530-10

CONN SOCKET SIP 27POS TIN

Aries Electronics

3,675 -
27-7530-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 27 (1 x 27) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
27-7550-10

27-7550-10

CONN SOCKET SIP 27POS TIN

Aries Electronics

3,199 -
27-7550-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 27 (1 x 27) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
27-7580-10

27-7580-10

CONN SOCKET SIP 27POS TIN

Aries Electronics

2,967 -
27-7580-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 27 (1 x 27) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
27-7650-10

27-7650-10

CONN SOCKET SIP 27POS TIN

Aries Electronics

3,238 -
27-7650-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 27 (1 x 27) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-0511-11

16-0511-11

CONN SOCKET SIP 16POS GOLD

Aries Electronics

2,636 -
16-0511-11

Datasheet

Bulk 511 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-6518-01

40-6518-01

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2,852 -
40-6518-01

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-3574-10

32-3574-10

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

2,197 -
32-3574-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
32-9513-11H

32-9513-11H

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,555 -
32-9513-11H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-4508-30

24-4508-30

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,320 -
24-4508-30

Datasheet

Bulk 508 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
48-6518-10E

48-6518-10E

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

2,602 -
48-6518-10E

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-526-11

24-526-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

3,605 -
24-526-11

Datasheet

Bulk Lo-PRO®file, 526 Active DIP, ZIF (ZIP) 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
120-PGM13015-10

120-PGM13015-10

CONN SOCKET PGA GOLD

Aries Electronics

2,401 -
120-PGM13015-10

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-0503-21

22-0503-21

CONN SOCKET SIP 22POS GOLD

Aries Electronics

3,118 -
22-0503-21

Datasheet

Bulk 0503 Active SIP 22 (1 x 22) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
22-0503-31

22-0503-31

CONN SOCKET SIP 22POS GOLD

Aries Electronics

3,111 -
22-0503-31

Datasheet

Bulk 0503 Active SIP 22 (1 x 22) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
37-PGM10012-11

37-PGM10012-11

CONN SOCKET PGA GOLD

Aries Electronics

2,198 -
37-PGM10012-11

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
15-0511-11

15-0511-11

CONN SOCKET SIP 15POS GOLD

Aries Electronics

3,940 -
15-0511-11

Datasheet

Bulk 511 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-3508-211

16-3508-211

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,026 -
16-3508-211

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-3508-311

16-3508-311

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,308 -
16-3508-311

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-7440-10

28-7440-10

CONN SOCKET SIP 28POS TIN

Aries Electronics

3,607 -
28-7440-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 28 (1 x 28) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
28-7750-10

28-7750-10

CONN SOCKET SIP 28POS TIN

Aries Electronics

2,832 -
28-7750-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 28 (1 x 28) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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