Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
48-6511-11

48-6511-11

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

3,703 -
48-6511-11

Datasheet

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-0501-21

24-0501-21

CONN SOCKET SIP 24POS GOLD

Aries Electronics

2,368 -
24-0501-21

Datasheet

Bulk 501 Active SIP 24 (1 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-0501-31

24-0501-31

CONN SOCKET SIP 24POS GOLD

Aries Electronics

2,811 -
24-0501-31

Datasheet

Bulk 501 Active SIP 24 (1 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-9503-20

32-9503-20

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,867 -
32-9503-20

Datasheet

Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-9503-30

32-9503-30

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,029 -
32-9503-30

Datasheet

Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-4508-20

24-4508-20

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,545 -
24-4508-20

Datasheet

Bulk 508 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
13-0511-11

13-0511-11

CONN SOCKET SIP 13POS GOLD

Aries Electronics

3,555 -
13-0511-11

Datasheet

Bulk 511 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-6621-30

20-6621-30

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

2,861 -
20-6621-30

Datasheet

Bulk 6621 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-0501-21

25-0501-21

CONN SOCKET SIP 25POS GOLD

Aries Electronics

3,227 -
25-0501-21

Datasheet

Bulk 501 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-0501-31

25-0501-31

CONN SOCKET SIP 25POS GOLD

Aries Electronics

2,986 -
25-0501-31

Datasheet

Bulk 501 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
29-0501-20

29-0501-20

CONN SOCKET SIP 29POS TIN

Aries Electronics

3,248 -
29-0501-20

Datasheet

Bulk 501 Active SIP 29 (1 x 29) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
29-0501-30

29-0501-30

CONN SOCKET SIP 29POS TIN

Aries Electronics

3,281 -
29-0501-30

Datasheet

Bulk 501 Active SIP 29 (1 x 29) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
23-0501-21

23-0501-21

CONN SOCKET SIP 23POS GOLD

Aries Electronics

3,312 -
23-0501-21

Datasheet

Bulk 501 Active SIP 23 (1 x 23) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
23-0501-31

23-0501-31

CONN SOCKET SIP 23POS GOLD

Aries Electronics

2,473 -
23-0501-31

Datasheet

Bulk 501 Active SIP 23 (1 x 23) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
26-71250-10

26-71250-10

CONN SOCKET SIP 26POS TIN

Aries Electronics

3,931 -
26-71250-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 26 (1 x 26) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
26-7500-10

26-7500-10

CONN SOCKET SIP 26POS TIN

Aries Electronics

3,549 -
26-7500-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 26 (1 x 26) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
26-7590-10

26-7590-10

CONN SOCKET SIP 26POS TIN

Aries Electronics

3,951 -
26-7590-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 26 (1 x 26) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
26-7650-10

26-7650-10

CONN SOCKET SIP 26POS TIN

Aries Electronics

3,109 -
26-7650-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 26 (1 x 26) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-6553-11

24-6553-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

3,215 -
Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3551-11

24-3551-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

3,933 -
24-3551-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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