Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
20-7600-11

20-7600-11

CONN SOCKET SIP 20POS GOLD

Aries Electronics

3,446 -
20-7600-11

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
17-0503-21

17-0503-21

CONN SOCKET SIP 17POS GOLD

Aries Electronics

2,906 -
17-0503-21

Datasheet

Bulk 0503 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
17-0503-31

17-0503-31

CONN SOCKET SIP 17POS GOLD

Aries Electronics

2,048 -
17-0503-31

Datasheet

Bulk 0503 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
20-6820-90

20-6820-90

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,520 -
20-6820-90

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
20-6823-90

20-6823-90

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,454 -
20-6823-90

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
28-516-11S

28-516-11S

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics

2,187 -
28-516-11S

Datasheet

Bulk 516 Active DIP, ZIF (ZIP) 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
14-810-90WR

14-810-90WR

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3,638 -
14-810-90WR

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
23-0501-20

23-0501-20

CONN SOCKET SIP 23POS TIN

Aries Electronics

3,112 -
23-0501-20

Datasheet

Bulk 501 Active SIP 23 (1 x 23) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
23-0501-30

23-0501-30

CONN SOCKET SIP 23POS TIN

Aries Electronics

2,904 -
23-0501-30

Datasheet

Bulk 501 Active SIP 23 (1 x 23) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
26-6823-90C

26-6823-90C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

3,864 -
26-6823-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
26-820-90C

26-820-90C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

3,314 -
26-820-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
26-822-90C

26-822-90C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

2,978 -
26-822-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
26-823-90C

26-823-90C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

2,948 -
26-823-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-3508-20

24-3508-20

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,908 -
24-3508-20

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-3508-30

24-3508-30

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,369 -
24-3508-30

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6508-20

24-6508-20

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,119 -
24-6508-20

Datasheet

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6508-30

24-6508-30

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,489 -
24-6508-30

Datasheet

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-6503-20

30-6503-20

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

3,109 -
30-6503-20

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
30-6503-30

30-6503-30

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

3,069 -
30-6503-30

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-6511-11

32-6511-11

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,828 -
32-6511-11

Datasheet

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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