Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
24-6572-10

24-6572-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

3,434 -
24-6572-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6573-10

24-6573-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

2,955 -
24-6573-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6575-10

24-6575-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

2,475 -
24-6575-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3570-10

24-3570-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

3,507 -
24-3570-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6570-10

24-6570-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

2,112 -
24-6570-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-6518-01

28-6518-01

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,252 -
28-6518-01

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-6621-30

14-6621-30

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

2,717 -
14-6621-30

Datasheet

Bulk 6621 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
48-6513-11H

48-6513-11H

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

3,879 -
48-6513-11H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-6518-11H

40-6518-11H

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3,916 -
40-6518-11H

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
36-6513-11H

36-6513-11H

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

2,505 -
36-6513-11H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-0508-20

32-0508-20

CONN SOCKET SIP 32POS GOLD

Aries Electronics

2,568 -
32-0508-20

Datasheet

Bulk 508 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
32-0508-30

32-0508-30

CONN SOCKET SIP 32POS GOLD

Aries Electronics

3,323 -
32-0508-30

Datasheet

Bulk 508 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
32-1508-20

32-1508-20

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,914 -
32-1508-20

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
32-1508-30

32-1508-30

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,598 -
32-1508-30

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
18-71000-10

18-71000-10

CONN SOCKET SIP 18POS TIN

Aries Electronics

2,879 -
18-71000-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 18 (1 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-7500-10

18-7500-10

CONN SOCKET SIP 18POS TIN

Aries Electronics

3,801 -
18-7500-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 18 (1 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-7625-10

18-7625-10

CONN SOCKET SIP 18POS TIN

Aries Electronics

2,366 -
18-7625-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 18 (1 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-7650-10

18-7650-10

CONN SOCKET SIP 18POS TIN

Aries Electronics

2,427 -
18-7650-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 18 (1 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-7740-10

18-7740-10

CONN SOCKET SIP 18POS TIN

Aries Electronics

3,036 -
18-7740-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 18 (1 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-7490-11

20-7490-11

CONN SOCKET SIP 20POS GOLD

Aries Electronics

2,032 -
20-7490-11

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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