Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
317-47-118-41-005000

317-47-118-41-005000

STANDRD SOLDRTL SNG SKT

Mill-Max Manufacturing Corp.

2,430 -
317-47-118-41-005000

Datenblatt

Bulk 317 Active SIP 18 (1 x 18) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-91-318-41-003000

115-91-318-41-003000

SOCKET IC OPEN LOWPRO .300 18POS

Mill-Max Manufacturing Corp.

3,003 -
Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Thermoplastic
115-41-318-41-003000

115-41-318-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,728 -
115-41-318-41-003000

Datenblatt

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-314-41-007000

116-47-314-41-007000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

3,630 -
116-47-314-41-007000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-320-41-605000

110-93-320-41-605000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

2,965 -
110-93-320-41-605000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-320-41-605000

110-43-320-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,934 -
110-43-320-41-605000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-11-306-41-001000

121-11-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,775 -
121-11-306-41-001000

Datenblatt

Tube 121 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-308-41-004000

612-41-308-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,072 -
612-41-308-41-004000

Datenblatt

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-308-41-004000

612-91-308-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,038 -
612-91-308-41-004000

Datenblatt

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-44-632-41-003000

115-44-632-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,974 -
115-44-632-41-003000

Datenblatt

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-41-324-41-117000

114-41-324-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,756 -
114-41-324-41-117000

Datenblatt

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-41-424-41-117000

114-41-424-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,857 -
114-41-424-41-117000

Datenblatt

Tube 114 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-41-624-41-117000

114-41-624-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,017 -
114-41-624-41-117000

Datenblatt

Tube 114 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-91-324-41-117000

114-91-324-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,513 -
114-91-324-41-117000

Datenblatt

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-91-424-41-117000

114-91-424-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,514 -
114-91-424-41-117000

Datenblatt

Tube 114 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-91-624-41-117000

114-91-624-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,032 -
114-91-624-41-117000

Datenblatt

Tube 114 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-PGM07002-10

32-PGM07002-10

CONN SOCKET PGA GOLD

Aries Electronics

3,620 -
32-PGM07002-10

Datenblatt

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-0501-21

20-0501-21

CONN SOCKET SIP 20POS GOLD

Aries Electronics

2,002 -
20-0501-21

Datenblatt

Bulk 501 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-0501-31

20-0501-31

CONN SOCKET SIP 20POS GOLD

Aries Electronics

3,149 -
20-0501-31

Datenblatt

Bulk 501 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
612-93-308-41-001000

612-93-308-41-001000

SOCKET CARRIER SLDRTL .300 8POS

Mill-Max Manufacturing Corp.

3,740 -
612-93-308-41-001000

Datenblatt

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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