Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
614-83-101-13-061112

614-83-101-13-061112

CONN SOCKET PGA 101POS GOLD

Preci-Dip

2,468 -
614-83-101-13-061112

Datenblatt

Bulk 614 Active PGA 101 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-41-316-41-605000

110-41-316-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,661 -
110-41-316-41-605000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-91-316-41-605000

110-91-316-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,901 -
110-91-316-41-605000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-93-316-41-117000

114-93-316-41-117000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

3,523 -
114-93-316-41-117000

Datenblatt

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-43-316-41-117000

114-43-316-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,911 -
114-43-316-41-117000

Datenblatt

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
122-11-308-41-001000

122-11-308-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,988 -
122-11-308-41-001000

Datenblatt

Tube 122 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-41-632-41-001000

210-41-632-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,204 -
210-41-632-41-001000

Datenblatt

Tube 210 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-91-632-41-001000

210-91-632-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,057 -
210-91-632-41-001000

Datenblatt

Tube 210 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-93-314-41-012000

146-93-314-41-012000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

2,674 -
146-93-314-41-012000

Datenblatt

Tube 146 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-43-314-41-012000

146-43-314-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.

3,200 -
146-43-314-41-012000

Datenblatt

Tube 146 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-318-41-605000

110-47-318-41-605000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

3,978 -
110-47-318-41-605000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
18-0501-20

18-0501-20

CONN SOCKET SIP 18POS TIN

Aries Electronics

2,290 -
18-0501-20

Datenblatt

Bulk 501 Active SIP 18 (1 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-0501-30

18-0501-30

CONN SOCKET SIP 18POS TIN

Aries Electronics

3,516 -
18-0501-30

Datenblatt

Bulk 501 Active SIP 18 (1 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
APA-320-G-M

APA-320-G-M

ADAPTER PLUG

Samtec Inc.

2,709 -
Tube APA Active - 20 (2 x 10) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
117-47-620-41-005000

117-47-620-41-005000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

2,999 -
117-47-620-41-005000

Datenblatt

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
410-91-220-10-001000

410-91-220-10-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

2,865 -
410-91-220-10-001000

Datenblatt

Tube 410 Active Zig-Zag, Left Stackable 20 (2 x 10) 0.100 (2.54mm) - - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
410-91-220-10-002000

410-91-220-10-002000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

3,331 -
410-91-220-10-002000

Datenblatt

Tube 410 Active Zig-Zag, Right Stackable 20 (2 x 10) 0.100 (2.54mm) - - Beryllium Copper Through Hole - Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-87-124-13-041112

614-87-124-13-041112

CONN SOCKET PGA 124POS GOLD

Preci-Dip

2,057 -
614-87-124-13-041112

Datenblatt

Bulk 614 Active PGA 124 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-91-320-41-003000

115-91-320-41-003000

SOCKET IC OPEN LOWPRO .300 20POS

Mill-Max Manufacturing Corp.

2,295 -
Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Thermoplastic
115-41-320-41-003000

115-41-320-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,302 -
115-41-320-41-003000

Datenblatt

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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