Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
317-91-106-41-005000

317-91-106-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

3,024 -
317-91-106-41-005000

Datenblatt

Bulk 317 Active SIP 6 (1 x 6) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-306-31-002000

614-41-306-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,868 -
614-41-306-31-002000

Datenblatt

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-306-31-002000

614-91-306-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,267 -
614-91-306-31-002000

Datenblatt

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-306-41-008000

116-93-306-41-008000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

3,729 -
116-93-306-41-008000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-306-41-008000

116-43-306-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,846 -
116-43-306-41-008000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-306-41-001000

116-47-306-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

2,041 -
116-47-306-41-001000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-6518-11H

32-6518-11H

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,670 -
32-6518-11H

Datenblatt

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
614-93-306-31-012000

614-93-306-31-012000

SOCKET CARRIER LOWPRO .300 6POS

Mill-Max Manufacturing Corp.

3,225 -
614-93-306-31-012000

Datenblatt

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-306-31-012000

614-43-306-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,114 -
614-43-306-31-012000

Datenblatt

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-310-41-007000

116-93-310-41-007000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

2,895 -
116-93-310-41-007000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-310-41-007000

116-43-310-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,134 -
116-43-310-41-007000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-47-320-41-003000

115-47-320-41-003000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

3,983 -
115-47-320-41-003000

Datenblatt

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-99-428-41-001000

110-99-428-41-001000

CONN IC DIP SOCKET 28POS TINLEAD

Mill-Max Manufacturing Corp.

3,515 -
110-99-428-41-001000

Datenblatt

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-44-428-41-001000

110-44-428-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,623 -
110-44-428-41-001000

Datenblatt

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-91-316-41-003000

115-91-316-41-003000

SOCKET IC OPEN LOWPRO .300 16POS

Mill-Max Manufacturing Corp.

3,574 -
Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Thermoplastic
115-41-316-41-003000

115-41-316-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,998 -
115-41-316-41-003000

Datenblatt

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-83-650-41-013101

116-83-650-41-013101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

2,267 -
116-83-650-41-013101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-91-310-41-001000

123-91-310-41-001000

SOCKET IC OPEN 3 LVL .300 10POS

Mill-Max Manufacturing Corp.

2,343 -
Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-41-310-41-001000

123-41-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,915 -
123-41-310-41-001000

Datenblatt

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-93-310-41-002000

124-93-310-41-002000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

3,545 -
124-93-310-41-002000

Datenblatt

Tube 124 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Record«Prev1... 322323324325326327328329...1100Next»
HEIM

HEIM

PRODUKT

PRODUKT

TELEFON

TELEFON

BENUTZER

BENUTZER