Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
126-41-310-41-002000

126-41-310-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,959 -
126-41-310-41-002000

Datenblatt

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-310-41-002000

126-91-310-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,637 -
126-91-310-41-002000

Datenblatt

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
24-3554-10

24-3554-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

2,308 -
24-3554-10

Datenblatt

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
317-91-103-41-005000

317-91-103-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

2,630 -
317-91-103-41-005000

Datenblatt

Bulk 317 Active SIP 3 (1 x 3) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-41-306-41-001000

111-41-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,223 -
111-41-306-41-001000

Datenblatt

Tube 111 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-91-306-41-001000

111-91-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,227 -
111-91-306-41-001000

Datenblatt

Tube 111 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-47-306-41-117000

114-47-306-41-117000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

3,464 -
114-47-306-41-117000

Datenblatt

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
48-6518-10M

48-6518-10M

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

3,641 -
48-6518-10M

Datenblatt

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
104-11-210-41-780000

104-11-210-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,813 -
104-11-210-41-780000

Datenblatt

Tube 104 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-93-306-41-001000

115-93-306-41-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

2,141 -
115-93-306-41-001000

Datenblatt

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-306-41-001000

115-43-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,265 -
115-43-306-41-001000

Datenblatt

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-93-310-41-001000

111-93-310-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

3,904 -
111-93-310-41-001000

Datenblatt

Tube 111 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-43-310-41-001000

111-43-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,724 -
111-43-310-41-001000

Datenblatt

Tube 111 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-47-314-41-003000

115-47-314-41-003000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

2,908 -
115-47-314-41-003000

Datenblatt

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-306-41-780000

104-11-306-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,369 -
104-11-306-41-780000

Datenblatt

Tube 104 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-210-31-012000

614-41-210-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,122 -
614-41-210-31-012000

Datenblatt

Tube 614 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-210-31-012000

614-91-210-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,504 -
614-91-210-31-012000

Datenblatt

Tube 614 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-43-306-41-001000

210-43-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,151 -
210-43-306-41-001000

Datenblatt

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-93-306-41-001000

210-93-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,244 -
210-93-306-41-001000

Datenblatt

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-41-210-41-117000

114-41-210-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,768 -
114-41-210-41-117000

Datenblatt

Tube 114 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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