Foto | Herst. Teil # | Verfügbarkeit | Preis | Menge | Datenblatt | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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210-41-308-41-001000CONN IC SKT DBL |
3,392 | - |
|
![]() Datenblatt |
Tube | 210 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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210-91-308-41-001000CONN IC SKT DBL |
3,601 | - |
|
![]() Datenblatt |
Tube | 210 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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126-93-310-41-001000CONN IC DIP SOCKET 10POS GOLD |
3,826 | - |
|
![]() Datenblatt |
Tube | 126 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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126-43-310-41-001000CONN IC SKT DBL |
2,327 | - |
|
![]() Datenblatt |
Tube | 126 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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8080-1G17CONN TRANSIST TO-3 3POS TIN |
2,158 | - |
|
![]() Datenblatt |
Bulk | 8060 | Active | Transistor, TO-3 | 3 (Oval) | - | Tin | - | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Tin | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) |
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116-93-210-41-008000CONN IC DIP SOCKET 10POS GOLD |
3,808 | - |
|
![]() Datenblatt |
Tube | 116 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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116-43-210-41-008000CONN IC SKT DBL |
2,566 | - |
|
![]() Datenblatt |
Tube | 116 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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550-10-084-13-081101PGA SOLDER TAIL |
3,408 | - |
|
![]() Datenblatt |
Bulk | 550 | Active | PGA | 84 (13 x 13) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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115-41-306-41-001000CONN IC SKT DBL |
3,343 | - |
|
![]() Datenblatt |
Tube | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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115-91-306-41-001000SKT IC OPEN LOWPRO |
2,489 | - |
|
![]() Datenblatt |
Tube | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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111-47-210-41-001000STANDRD SOLDRTL DBL SKT |
2,416 | - |
|
![]() Datenblatt |
Tube | 111 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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612-41-310-41-003000SKT CARRIER SOLDRTL |
2,612 | - |
|
![]() Datenblatt |
Tube | 612 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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612-91-310-41-003000SKT CARRIER SOLDRTL |
3,815 | - |
|
![]() Datenblatt |
Tube | 612 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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115-93-310-41-001000CONN IC DIP SOCKET 10POS GOLD |
3,236 | - |
|
![]() Datenblatt |
Tube | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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115-43-310-41-001000CONN IC SKT DBL |
2,737 | - |
|
![]() Datenblatt |
Tube | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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114-41-310-41-117000CONN IC SKT DBL |
3,978 | - |
|
![]() Datenblatt |
Tube | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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114-91-310-41-117000CONN IC SKT DBL |
3,676 | - |
|
![]() Datenblatt |
Tube | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
![]() |
116-47-210-41-001000STANDRD SOLDRTL DBL SKT |
2,448 | - |
|
![]() Datenblatt |
Tube | 116 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
![]() |
115-41-210-41-001000CONN IC SKT DBL |
3,213 | - |
|
![]() Datenblatt |
Tube | 115 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
![]() |
115-91-210-41-001000SKT IC OPEN LOWPRO |
2,720 | - |
|
![]() Datenblatt |
Tube | 115 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |