Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
40-3513-11

40-3513-11

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2,569 -
40-3513-11

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
34-6501-20

34-6501-20

CONN IC DIP SOCKET 34POS TIN

Aries Electronics

2,440 -
34-6501-20

Datenblatt

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
34-6501-30

34-6501-30

CONN IC DIP SOCKET 34POS TIN

Aries Electronics

2,491 -
34-6501-30

Datenblatt

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
30-3513-10H

30-3513-10H

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

3,134 -
30-3513-10H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-C182-11

32-C182-11

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,196 -
32-C182-11

Datenblatt

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-C212-11

32-C212-11

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,581 -
32-C212-11

Datenblatt

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-C300-11

32-C300-11

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,316 -
32-C300-11

Datenblatt

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-6823-90

12-6823-90

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

3,839 -
12-6823-90

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
APA-648-T-A1

APA-648-T-A1

ADAPTER PLUG

Samtec Inc.

3,244 -
Bulk APA Active - 48 (2 x 24) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
24-4518-11H

24-4518-11H

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,703 -
24-4518-11H

Datenblatt

Bulk 518 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-83-225-18-019101

510-83-225-18-019101

CONN SOCKET PGA 225POS GOLD

Preci-Dip

3,786 -
510-83-225-18-019101

Datenblatt

Bulk 510 Active PGA 225 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-085-11-041112

614-83-085-11-041112

CONN SOCKET PGA 85POS GOLD

Preci-Dip

2,817 -
614-83-085-11-041112

Datenblatt

Bulk 614 Active PGA 85 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-225-18-091101

510-83-225-18-091101

CONN SOCKET PGA 225POS GOLD

Preci-Dip

2,730 -
510-83-225-18-091101

Datenblatt

Bulk 510 Active PGA 225 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ICA-632-SGG

ICA-632-SGG

CONN IC DIP SOCKET 32POS GOLD

Samtec Inc.

3,199 -
ICA-632-SGG

Datenblatt

Tube ICA Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Polyester
510-83-225-15-000101

510-83-225-15-000101

CONN SOCKET PGA 225POS GOLD

Preci-Dip

3,806 -
510-83-225-15-000101

Datenblatt

Bulk 510 Active PGA 225 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-225-17-001101

510-83-225-17-001101

CONN SOCKET PGA 225POS GOLD

Preci-Dip

3,433 -
510-83-225-17-001101

Datenblatt

Bulk 510 Active PGA 225 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-225-17-061101

510-83-225-17-061101

CONN SOCKET PGA 225POS GOLD

Preci-Dip

3,747 -
510-83-225-17-061101

Datenblatt

Bulk 510 Active PGA 225 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-80-100-15-001101

550-80-100-15-001101

PGA SOLDER TAIL

Preci-Dip

2,435 -
550-80-100-15-001101

Datenblatt

Bulk 550 Active PGA 100 (15 x 15) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
39-0518-11H

39-0518-11H

CONN SOCKET SIP 39POS GOLD

Aries Electronics

2,935 -
39-0518-11H

Datenblatt

Bulk 518 Active SIP 39 (1 x 39) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-6810-90C

16-6810-90C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3,370 -
16-6810-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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