Steckdosen für ICs, Transistoren

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Foto Herst. Teil # Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
24-6503-30

24-6503-30

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,143 -
24-6503-30

Datenblatt

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
21-0503-20

21-0503-20

CONN SOCKET SIP 21POS GOLD

Aries Electronics

2,994 -
21-0503-20

Datenblatt

Bulk 0503 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
21-0503-30

21-0503-30

CONN SOCKET SIP 21POS GOLD

Aries Electronics

2,541 -
21-0503-30

Datenblatt

Bulk 0503 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
32-C212-10H

32-C212-10H

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,723 -
32-C212-10H

Datenblatt

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-0501-21

10-0501-21

CONN SOCKET SIP 10POS GOLD

Aries Electronics

2,993 -
10-0501-21

Datenblatt

Bulk 501 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
546-87-121-13-061135

546-87-121-13-061135

CONN SOCKET PGA 121POS GOLD

Preci-Dip

3,796 -
546-87-121-13-061135

Datenblatt

Bulk 546 Active PGA 121 (13 x 13) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-121-13-061136

546-87-121-13-061136

CONN SOCKET PGA 121POS GOLD

Preci-Dip

2,000 -
546-87-121-13-061136

Datenblatt

Bulk 546 Active PGA 121 (13 x 13) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-642-41-013101

116-83-642-41-013101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

2,614 -
116-83-642-41-013101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-223-18-002101

510-83-223-18-002101

CONN SOCKET PGA 223POS GOLD

Preci-Dip

3,070 -
510-83-223-18-002101

Datenblatt

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-223-18-091101

510-83-223-18-091101

CONN SOCKET PGA 223POS GOLD

Preci-Dip

3,508 -
510-83-223-18-091101

Datenblatt

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-223-18-092101

510-83-223-18-092101

CONN SOCKET PGA 223POS GOLD

Preci-Dip

2,328 -
510-83-223-18-092101

Datenblatt

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-223-18-093101

510-83-223-18-093101

CONN SOCKET PGA 223POS GOLD

Preci-Dip

3,117 -
510-83-223-18-093101

Datenblatt

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-223-18-094101

510-83-223-18-094101

CONN SOCKET PGA 223POS GOLD

Preci-Dip

2,599 -
510-83-223-18-094101

Datenblatt

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-084-10-031112

614-83-084-10-031112

CONN SOCKET PGA 84POS GOLD

Preci-Dip

3,647 -
614-83-084-10-031112

Datenblatt

Bulk 614 Active PGA 84 (10 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-084-10-001112

614-83-084-10-001112

CONN SOCKET PGA 84POS GOLD

Preci-Dip

2,435 -
614-83-084-10-001112

Datenblatt

Bulk 614 Active PGA 84 (10 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-224-18-091101

510-83-224-18-091101

CONN SOCKET PGA 224POS GOLD

Preci-Dip

3,235 -
510-83-224-18-091101

Datenblatt

Bulk 510 Active PGA 224 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
30-6513-11H

30-6513-11H

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

2,870 -
30-6513-11H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-6810-90

12-6810-90

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

2,647 -
12-6810-90

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
09-71000-10

09-71000-10

CONN SOCKET SIP 9POS TIN

Aries Electronics

2,625 -
09-71000-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 9 (1 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
09-7325-10

09-7325-10

CONN SOCKET SIP 9POS TIN

Aries Electronics

3,182 -
09-7325-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 9 (1 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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